MCIMX357DVM5B Freescale Semiconductor, MCIMX357DVM5B Datasheet - Page 53

PROCESSOR MULTIMEDIA 400PBGA

MCIMX357DVM5B

Manufacturer Part Number
MCIMX357DVM5B
Description
PROCESSOR MULTIMEDIA 400PBGA
Manufacturer
Freescale Semiconductor
Series
i.MX35r
Datasheet

Specifications of MCIMX357DVM5B

Core Processor
ARM11
Core Size
32-Bit
Speed
532MHz
Connectivity
1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-20°C ~ 70°C
Package / Case
400-BGA
Operating Temperature (min)
-20C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
BGA
No. Of Pins
400
Operating Temperature Range
-20°C To +70°C
Processor Type
I.MX35
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

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Freescale Semiconductor
DQS (input)
SDCLK_B
DQ (input)
SDCLK
Figure 34. DDR2 SDRAM DQ vs. DQS and SDCLK READ Cycle Timing Diagram
SDR SDRAM CLK parameters are measured from the 50% point—that is,
“high” is defined as 50% of signal value and “low” is defined as 50% of
signal value. DDR SDRAM CLK parameters are measured at the crossing
point of SDCLK and SDCLK (inverted clock).
Test conditions are: Capacitance 15 pF for DDR PADS. Recommended
drive strength is Medium for SDCLK and High for Address and controls.
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
DDR26
DDR24
Table 39. DDR Single-ended Slew Rate
DATA
DATA
DDR25
NOTE
DATA
DATA
DATA
DATA
DATA
DATA
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