MM908E625ACDWB Freescale Semiconductor, MM908E625ACDWB Datasheet - Page 5

• Manufacturer Part Number: MM908E625ACDWB
• Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MM908E625ACDWB

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• Ram Size: 512 x 8
• Interface: SCI, SPI
• Number Of I /o: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (0.300", 7.50mm Width) Exposed Pad
• Program Memory Size: 16 KB
• Number Of Programmable I/os: 54
• Number Of Timers: 16
• Operating Supply Voltage: - 18 V to + 28 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 2. Maximum Ratings
permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Supply Voltage
Input Pin Voltage
Maximum Microcontroller Current per Pin
Maximum Microcontroller V
Maximum Microcontroller V
LIN Supply Voltage
ESD Voltage
Storage Temperature
Ambient Operating Temperature
Operating Case Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Solder Mounting
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1.
2.
3.
4.
5.
6.
7.
Analog Chip Supply Voltage under Normal Operation, Steady State
Analog Chip Supply Voltage under Transient Conditions
Microcontroller Chip Supply Voltage
Analog Chip
Microcontroller Chip
All Pins Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Pins PTA0:PTA6, PTC0:PTC1
Normal Operation (Steady-State)
Transient Conditions
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
Transient capability for pulses with a time of t < 0.5 sec.
ESD voltage testing is performed in accordance with the Human Body Model (C
ESD voltage testing is performed in accordance with the Machine Model (C
ESD voltage testing is performed in accordance with Charge Device Model, robotic (C
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
(1)
(3)
SS
DD
(2)
(5)
Output Current
Input Current
(4)
(6)
Ratings
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
(1)
(7)
V
ZAP
V
BUS(DYNAMIC)
IN
V
V
V
V
T
Symbol
=200 pF, R
SOLDER
ZAP
SUP(
SUP(
IN
I
I
I
BUS(SS)
I
(ANALOG)
V
PIN
PIN
T
MVSS
MVDD
V
T
T
ESD
STG
T
(MCU)
DD
A
C
J
= 100 pF, R
(1)
(2)
SS
PK
ZAP
)
)
=4.0 pF).
ZAP
= 0 Ω)
V
ZAP
SS
ELECTRICAL CHARACTERISTICS
-0.3 to V
= 1500 Ω)
-0.3 to 6.0
-0.3 to 5.5
-40 to 150
-40 to 125
-0.3 to 28
-0.3 to 40
-40 to 85
-40 to 85
-18 to 28
±3000
Value
±150
±500
±25
±15
100
100
245
40
DD
+0.3
MAXIMUM RATINGS
Unit
mA
mA
mA
°C
°C
°C
°C
°C
V
V
V
V
908E625
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