W83194R-58 WINBOND [Winbond], W83194R-58 Datasheet - Page 11

• Manufacturer Part Number: W83194R-58
• Description: 100 MHZ AGP CLOCK FOR VIA CHIPSET
• Manufacturer: WINBOND [Winbond]

9.0 SPECIFICATIONS
9.1 Absolute Maximum Ratings
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused inputs
must always be tied to an appropriate logic voltage level (Ground or V
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
9.2 AC Characteristics
V
Voltage on any pin with respect to GND
Storage Temperature
Ambient Temperature
Operating Temperature
DD
Output Duty Cycle
CPU/SDRAM to PCI Offset
Skew (CPU-CPU), (PCI-
PCI), (SDRAM-SDRAM)
CPU/SDRAM
Cycle to Cycle Jitter
CPU/SDRAM
Absolute Jitter
Jitter Spectrum 20 dB
Bandwidth from Center
Output Rise (0.4V 2.0V)
& Fall (2.0V 0.4V) Time
Overshoot/Undershoot
Beyond Power Rails
Ring Back Exclusion
q2 = V
device.
PARAMETER
DD
= V
DD
q3 = 3.3V 5%, V
PARAMETER
DD
q2b = 2.375V~2.9V , T
t
SYM.
V
V
SKEW
BW
t
t
t
t
OFF
CCJ
t
TLH
THL
RBE
over
JA
J
MIN.
0.4
0.7
0.7
45
1
- 11 -
TYP.
A
50
= 0 C to +70 C
Preliminary W83194R-37/-58
SYMBOL
V
MAX.
250
500
500
DD
1.6
1.5
2.1
T
55
250
4
T
T
STG
, V
B
A
IN
UNITS
KHz
nS
pS
pS
pS
nS
Publication Release Date: April 1999
%
V
V
DD
).
Measured at 1.5V
15 pF Load Measured at
1.5V
15 pF Load Measured at
1.5V
15 pF Load on CPU and
PCI outputs
22
PCB run to 15 pF load
Ring Back must not enter
this range.
TEST CONDITIONS
- 65 C to +150 C
- 55 C to +125 C
- 0.5V to +7.0V
0 C to +70 C
at source of 8 inch
RATING
Revision A1