W83194R-58 WINBOND [Winbond], W83194R-58 Datasheet - Page 17

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W83194R-58

Manufacturer Part Number
W83194R-58
Description
100 MHZ AGP CLOCK FOR VIA CHIPSET
Manufacturer
WINBOND [Winbond]
Datasheet
12.0 POWER SUPPLY SUGGESTION
1. A solid ground plane should be placed around the clock device. Ground connections should be tied
2. C21, C22, C31, C36 are decoupling capacitors (0.1 F surface mount, low ESR, ceramic
3. C1 and C2 are supply filtering capacitors for low frequency power supply noise. A 22 F (or 10 F)
4. Use of Ferrite Bead (FB) are recommended to further reduce the power supply noise.
5. The power supply race to the V
to this main ground plane as short as possible. No cuts should be made in the ground plane around
the device.
capacitors.) They should be placed as possible as the V
tantalum capacitor is recommended.
resistance is negligible.
(3.3V)
VDD
C1
FB1
C32
C31
C33
C34
VDD Plane
DD
pins must be thick enough so that voltage drops across the trace
16
10
11
12
13
14
15
17
18
19
20
21
22
23
24
1
2
3
4
6
7
9
5
8
- 17 -
Preliminary W83194R-37/-58
33
32
31
30
29
28
27
26
25
48
47
46
45
43
42
41
40
39
38
37
36
35
34
44
DD
pin and the ground via.
VDD2 Plane
Publication Release Date: April 1999
C21
C35
C22
C36
FB2
(3.3Vor2.5V)
VDD2
C2
Revision A1

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