SSD1339U3 ETC1 [List of Unclassifed Manufacturers], SSD1339U3 Datasheet - Page 8

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SSD1339U3

Manufacturer Part Number
SSD1339U3
Description
132RGB x 132 with 2 smart Icon lines Dot Matrix OLED/PLED Segment/Common Driver with Controller
Manufacturer
ETC1 [List of Unclassifed Manufacturers]
Datasheet
5. DIE PAD FLOOR PLAN
Solomon Systech
Pad #1
Figure 2 – SSD1339Z pin assignment
Jul 2005
All alignment keys have size
75 µm x 75 µm
Die Size: 20989um x 2250um
Die Thickness: 457um +/- 25um
Min I/O pad pitch: 76.2 µm
Min SEG pad pitch: 41.2 µm
Min COM pad pitch: 41.2 µm
Bump Height: Nominal 15 µm
+ represents the centre of the
alignment mark
P 8/59
Rev 1.1
X-pos (µm)
-8176.0
-9140.0
8176.0
9140.0
SSD1339
Y-pos (µm)
-941.0
-941.0
307.0
307.0

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