PCF8534AH/1,518 NXP Semiconductors, PCF8534AH/1,518 Datasheet - Page 40

• Manufacturer Part Number: PCF8534AH/1,518
• Description: IC LCD DVR UNVRSL LOW-MUX 80LQFP
• Manufacturer: NXP Semiconductors

Specifications of PCF8534AH/1,518

• Package / Case: 80-LQFP
• Display Type: LCD
• Configuration: 60 Segment
• Interface: I²C
• Current - Supply: 8µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 30
• Number Of Segments: 240
• Maximum Clock Frequency: 400 KHz
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Maximum Supply Current: 50 mA
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Details
• Other names: 935284829518; PCF8534AH/1-T; PCF8534AH/1-T

NXP Semiconductors
PCF8534A_3
Product data sheet
18.3 Wave soldering
18.4 Reflow soldering
Key characteristics in wave soldering are:
Key characteristics in reflow soldering are:
Table 23.
Table 24.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
•
•
•
2.5
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 23
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
24
Rev. 03 — 10 November 2008
28.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Universal LCD driver for low multiplex rates
Figure
350 to 2000
260
250
245
28) than a SnPb process, thus
220
220
350
PCF8534A
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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