MAX5072ETJ+ Maxim Integrated Products, MAX5072ETJ+ Datasheet - Page 25

• Manufacturer Part Number: MAX5072ETJ+
• Description: IC CONV BUCK/BOOST 32-TQFN
• Manufacturer: Maxim Integrated Products
• Type: Step-Down (Buck), Step-Up (Boost)r

Specifications of MAX5072ETJ+

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 2
• Voltage - Output: 0.8 ~ 28 V
• Current - Output: 1A, 2A
• Frequency - Switching: 200kHz ~ 2.2MHz
• Voltage - Input: 4.5 ~ 23 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TQFN Exposed Pad
• Power - Output: 2.76W
• Output Voltage: 5.2 V
• Output Current: 2 A
• Input Voltage: 5.5 V to 23 V
• Supply Current: 2.2 mA
• Switching Frequency: 1250 KHz
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1) Place the power components first, with ground ter-
2) Group the gate-drive components (bootstrap
3) Make the DC-DC controller ground connections as
*EP = Exposed pad.
+Denotes lead-free package.
M AX5072E TJ+
MAX5072ATJ
M AX5072ATJ+ -40°C to +125°C
Ordering Information (continued)
minals adjacent (inductor, C
all these connections on the top layer with wide,
copper-filled areas (2oz copper recommended).
diodes and capacitors, and VL bypass capacitor)
together near the controller IC.
follows:
a) Create a small-signal ground plane underneath
PART
the IC.
Converter with POR and Power-Fail Output
-40°C to +125°C
-40°C to +85°C
TEMP RANGE
______________________________________________________________________________________
2.2MHz, Dual-Output Buck or Boost
PIN-PACKAGE
32 Thin QFN-EP*
(5mm x 5mm)
32 Thin QFN-EP*
(5mm x 5mm)
32 Thin QFN-EP*
(5mm x 5mm)
IN_
Layout Procedure
, and C
OUT_
). Make
T3255-4
T3255-4
T3255-4
PKG
CODE
TRANSISTOR COUNT: 5994
PROCESS: BiCMOS
b) Connect this plane to SGND and use this plane
c) Connect SGND and PGND together near the
for the ground connection for the reference
(BYPASS), enable, compensation components,
feedback dividers, and OSC resistor.
input bypass capacitors and the IC (this is the
only connection between SGND and PGND).
Chip Information
25