PIC18F13K22-I/ML Microchip Technology, PIC18F13K22-I/ML Datasheet - Page 7

• Manufacturer Part Number: PIC18F13K22-I/ML
• Description: IC MCU 8BIT 8KB FLASH 20-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F13K22-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, MSSP, SPI, USART
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer1 Module ........................................................................................................................................................................... 99
11.0 Timer2 Module ......................................................................................................................................................................... 105
12.0 Timer3 Module ......................................................................................................................................................................... 107
13.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 111
14.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 131
15.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 173
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 201
17.0 Comparator Module.................................................................................................................................................................. 215
18.0 Power-Managed Modes ........................................................................................................................................................... 227
19.0 SR Latch................................................................................................................................................................................... 233
20.0 Voltage References.................................................................................................................................................................. 237
21.0 Reset ........................................................................................................................................................................................ 241
22.0 Special Features of the CPU.................................................................................................................................................... 253
23.0 Instruction Set Summary .......................................................................................................................................................... 269
24.0 Development Support............................................................................................................................................................... 319
25.0 Electrical Specifications............................................................................................................................................................ 323
26.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 357
27.0 Packaging Information.............................................................................................................................................................. 359
Appendix A: Revision History............................................................................................................................................................. 365
Appendix B: Device Differences ........................................................................................................................................................ 365
Index .................................................................................................................................................................................................. 367
The Microchip Web Site ..................................................................................................................................................................... 377
Customer Change Notification Service .............................................................................................................................................. 377
Customer Support .............................................................................................................................................................................. 377
Reader Response .............................................................................................................................................................................. 378
Product Identification System ............................................................................................................................................................ 379
© 2009 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 7
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 13
Memory Organization ................................................................................................................................................................. 25
Flash Program Memory.............................................................................................................................................................. 47
Data EEPROM Memory ............................................................................................................................................................. 57
8 x 8 Hardware Multiplier............................................................................................................................................................ 61
Interrupts .................................................................................................................................................................................... 63
I/O Ports ..................................................................................................................................................................................... 77
Timer0 Module ........................................................................................................................................................................... 95
Preliminary
PIC18F1XK22/LF1XK22
DS41365B-page 5