DSPIC33FJ32GP302-I/SO Microchip Technology, DSPIC33FJ32GP302-I/SO Datasheet - Page 241
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DSPIC33FJ32GP302-I/SO
Manufacturer Part Number
DSPIC33FJ32GP302-I/SO
Description
IC DSPIC MCU/DSP 32K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
4.DSPIC33FJ32GP204-IPT.pdf
(270 pages)
Specifications of DSPIC33FJ32GP302-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
4 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
I2C/SPI/UART
On-chip Adc
10-chx10-bit|10-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- DSPIC33FJ32GP204-IPT PDF datasheet #4
- Current page: 241 of 270
- Download datasheet (2Mb)
TABLE 23-10: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 23-11: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
2009 Microchip Technology Inc.
CHARACTERISTICS
HSP35
HSP36
HSP40
HSP41
Note 1:
HSP35
HSP40
HSP41
Note 1:
CHARACTERISTICS
Param
Param
No.
No.
AC
AC
TscH2doV,
TscL2doV
TdoV2sc,
TdoV2scL
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
These parameters are characterized but not tested in manufacturing.
These parameters are characterized but not tested in manufacturing.
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
Symbol
Symbol
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Characteristic
Characteristic
(1)
(1)
-40°C T
-40°C T
Preliminary
A
Min
Min
A
35
28
35
—
—
28
35
+140°C for High Temperature
+140°C for High Temperature
Typ
Typ
10
10
—
—
—
—
—
Max
Max
25
25
—
—
—
—
—
Units
Units
ns
ns
ns
ns
ns
ns
ns
DS70290F-page 241
Conditions
Conditions
—
—
—
—
—
—
—
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