DSPIC33FJ32GP302-I/SO Microchip Technology, DSPIC33FJ32GP302-I/SO Datasheet - Page 242
![IC DSPIC MCU/DSP 32K 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
DSPIC33FJ32GP302-I/SO
Manufacturer Part Number
DSPIC33FJ32GP302-I/SO
Description
IC DSPIC MCU/DSP 32K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
4.DSPIC33FJ32GP204-IPT.pdf
(270 pages)
Specifications of DSPIC33FJ32GP302-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
4 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
I2C/SPI/UART
On-chip Adc
10-chx10-bit|10-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- DSPIC33FJ32GP204-IPT PDF datasheet #4
- Current page: 242 of 270
- Download datasheet (2Mb)
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
TABLE 23-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 23-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS70290F-page 242
HSP35
HSP40
HSP41
HSP51
HSP60
Note 1:
CHARACTERISTICS
HSP35
HSP40
HSP41
HSP51
Note 1:
CHARACTERISTICS
Param
Param
No.
No.
2:
2:
AC
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ
AC
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ SSx to SDO
TssL2doV
Symbol
Symbol
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input to
SCKx Edge
SSx to SDOx Output
High-Impedance
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
High-Impedance
SDOx Data Output Valid after
SSx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Characteristic
Characteristic
X
Output
(1)
(1)
-40°C T
-40°C T
Preliminary
A
Min
Min
A
—
25
25
15
25
25
15
—
—
+140°C for High Temperature
+140°C for High Temperature
Typ
Typ
—
—
—
—
—
—
—
—
—
Max
Max
35
—
—
55
35
55
55
—
—
Units
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
2009 Microchip Technology Inc.
See Note 2
See Note 2
Conditions
Conditions
—
—
—
—
—
—
—
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