DSPIC33FJ32GP302-I/SO Microchip Technology, DSPIC33FJ32GP302-I/SO Datasheet - Page 249
![IC DSPIC MCU/DSP 32K 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
DSPIC33FJ32GP302-I/SO
Manufacturer Part Number
DSPIC33FJ32GP302-I/SO
Description
IC DSPIC MCU/DSP 32K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
4.DSPIC33FJ32GP204-IPT.pdf
(270 pages)
Specifications of DSPIC33FJ32GP302-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
4 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
I2C/SPI/UART
On-chip Adc
10-chx10-bit|10-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- DSPIC33FJ32GP204-IPT PDF datasheet #4
- Current page: 249 of 270
- Download datasheet (2Mb)
2009 Microchip Technology Inc.
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Preliminary
A2
Units
E1
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
β
8°
–
DS70290F-page 249
c
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