M306N5FCTFP#U0 Renesas Electronics America, M306N5FCTFP#U0 Datasheet - Page 400

IC M16C/6N MCU FLASH 128K 100QFP

M306N5FCTFP#U0

Manufacturer Part Number
M306N5FCTFP#U0
Description
IC M16C/6N MCU FLASH 128K 100QFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/6Nr
Datasheets

Specifications of M306N5FCTFP#U0

Core Processor
M16C/60
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, I²C, IEBus, SIO, UART/USART
Peripherals
DMA, WDT
Number Of I /o
87
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 26x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-QFP
For Use With
R0K3306NKS001BE - KIT DEV RSK RSK-M16C/6NKR0K3306NKS000BE - KIT DEV RSK RSK-M16C/6NK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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2.00 Nov. 10, 2004
Rev.
Date
REVISION HISTORY
292, 293 Figures 22.6 and 22.7 Timing Diagram (3) (4): "DB" in Read timing is revised to "DBi".
294, 295 Figures 22.8 and 22.9 Timing Diagram (5) (6): "DB" in Write timing is revised to "DBi".
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Table 22.1 Absolute Maximum Ratings
Table 22.3 Recommended Operating Conditions (2)
Figure 22.1 Timing of Voltage Fluctuation is added.
Table 22.4 Electrical Characteristics (1): Hysteresis
Table 22.6 A/D Conversion Characteristics: "Tolerance Level Impedance" is added.
Table 22.8 Power Supply Circuit Timing Characteristics: "t
Figure 22.2 Power Supply Circuit Timing Diagram is added.
Table 22.10 Memory Expansion Mode and Microprocessor Mode: "t
Table 22.21 Serial I/O: Min. of standard in t
Table 22.23 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
Table 22.24 Memory Expansion Mode and Microprocessor Mode (for 1- to 3-wait setting
and external area access)
Table 22.25 Memory Expansion Mode and Microprocessor Mode (for 2- to 3-wait setting,
external area access and multiplexed bus selection)
Figure 22.4 Timing Diagram (1): "XIN input" is added.
Figure 22.11 Timing Diagram (8)
23.1 External Bus: The description of the external ROM version is deleted.
23.2 PLL Frequency Synthesizer is revised.
23.3 Power Control
23.8.2.1 Special Mode 1 (I
23.8.3 SI/O3 is added.
23.9 A/D Converter: last item is added. (When setting the ADST bit to •••)
23.10.2 Performing CAN Configuration is added.
23.10.3 Suggestions to Reduce Power Consumption is added.
• "Flash Program Erase" in Operating Ambient Temperature is added.
• Parameters of Power Supply Ripple are added.
• NOTE 4 is revised.
• "CLK4" is revised to "CLK3", and "TA2OUT" is revised to "TA0OUT".
• XIN is added.
• Max. of Standard in t
• t
• Max. of Standard in t
• t
• t
• Max. of Standard in t
• "ADi/DB" in Read/Write timing is revised to "ADi/DBi".
• 2nd item is added. (Set the MR0 bit in the TAiMR register to •••)
• 4th item is revised. (Wait for main clock oscillation •••)
• Section of "External clock" is deleted.
Max. of Standard in RESET is revised from "2.2" to "2.5".
d(BCLK-HLDA)
d(BCLK-HLDA)
d(BCLK-HLDA)
is added.
is added.
is added.
M16C/6N Group (M16C/6N5) Hardware Manual
____________
d(BCLK-ALE)
d(BCLK-ALE)
d(BCLK-ALE)
C-6
2
C Mode) is added.
Description
is revised from "25" to "15".
is revised from "25" to "15".
is revised from "25" to "15".
Summary
su(D-C)
is revised from "30" to "70".
d(M-L)
" is deleted.
d(BCLK-HLDA)
" is deleted.

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