PIC18LF1330-I/SO Microchip Technology, PIC18LF1330-I/SO Datasheet - Page 292
![IC PIC MCU FLASH 4KX16 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC18LF1330-I/SO
Manufacturer Part Number
PIC18LF1330-I/SO
Description
IC PIC MCU FLASH 4KX16 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.AC162078.pdf
(318 pages)
3.PIC18F1230-ISO.pdf
(6 pages)
4.PIC18F1230-ISO.pdf
(12 pages)
5.PIC18F1230-ISO.pdf
(4 pages)
6.PIC18F1230-IP.pdf
(312 pages)
Specifications of PIC18LF1330-I/SO
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
16
Eeprom Memory Size
128Byte
Ram Memory Size
256Byte
Cpu Speed
40MHz
No.
RoHS Compliant
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF1330-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- AC162078 PDF datasheet #2
- PIC18F1230-ISO PDF datasheet #3
- PIC18F1230-ISO PDF datasheet #4
- PIC18F1230-ISO PDF datasheet #5
- PIC18F1230-IP PDF datasheet #6
- Current page: 292 of 312
- Download datasheet (6Mb)
PIC18F1230/1330
24.2
The following sections give the technical details of the packages.
DS39758C-page 290
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
1
N
2
b
b1
3
D
Advance Information
Dimension Limits
Units
e
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
E1
A2
.880
.045
.014
MIN
.115
.015
.300
.240
.115
.008
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.900
.130
.010
.060
.018
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
eB
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
–
c
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