PIC18LF1330-I/SO Microchip Technology, PIC18LF1330-I/SO Datasheet - Page 294
![IC PIC MCU FLASH 4KX16 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC18LF1330-I/SO
Manufacturer Part Number
PIC18LF1330-I/SO
Description
IC PIC MCU FLASH 4KX16 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.AC162078.pdf
(318 pages)
3.PIC18F1230-ISO.pdf
(6 pages)
4.PIC18F1230-ISO.pdf
(12 pages)
5.PIC18F1230-ISO.pdf
(4 pages)
6.PIC18F1230-IP.pdf
(312 pages)
Specifications of PIC18LF1330-I/SO
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
16
Eeprom Memory Size
128Byte
Ram Memory Size
256Byte
Cpu Speed
40MHz
No.
RoHS Compliant
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF1330-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- AC162078 PDF datasheet #2
- PIC18F1230-ISO PDF datasheet #3
- PIC18F1230-ISO PDF datasheet #4
- PIC18F1230-ISO PDF datasheet #5
- PIC18F1230-IP PDF datasheet #6
- Current page: 294 of 312
- Download datasheet (6Mb)
PIC18F1230/1330
DS39758C-page 292
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Advance Information
Dimension Limits
e
A2
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
E
c
MIN
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
© 2007 Microchip Technology Inc.
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
8°
–
φ
L
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