PIC18F2431-I/SO Microchip Technology, PIC18F2431-I/SO Datasheet - Page 23

• Manufacturer Part Number: PIC18F2431-I/SO
• Description: IC PIC MCU FLASH 8KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2431-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4431 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.0
2.1
The PIC18F2331/2431/4331/4431 devices can be
operated in 10 different oscillator modes. The user can
program the configuration bits F
uration register 1H to select one of these 10 modes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. ECIO
2.2
In XT, LP, HS or HSPLL oscillator modes, a crystal or
ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation. Figure 2-1 shows
the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
 2003 Microchip Technology Inc.
Note:
LP
XT
HS
HSPLL
RC
RCIO
INTIO1
INTIO2
EC
OSCILLATOR
CONFIGURATIONS
Oscillator Types
Crystal Oscillator/Ceramic
Resonators
Use of a series cut crystal may give a
frequency
manufacturers’ specifications.
with PLL enabled
F
output on RA6 and I/O on RA7
and RA7
Low-power Crystal
Crystal/Resonator
High-speed Crystal/Resonator
High-speed Crystal/Resonator
External Resistor/Capacitor with
External Resistor/Capacitor with
I/O on RA6
Internal Oscillator with F
Internal Oscillator with I/O on RA6
External Clock with F
External Clock with I/O on RA6
OSC
/4 output on RA6
out
OSC
of
3:F
OSC
OSC
the
0 in Config-
/4 output
PIC18F2331/2431/4331/4431
OSC
crystal
/4
Preliminary
FIGURE 2-1:
TABLE 2-1:
Capacitor values are for design guidance only.
These capacitors were tested with the resonators
listed below for basic start-up and operation. These
values are not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes on page 22 for additional information.
Note 1: See Table 2-1 and Table 2-2 for initial values of
DD
Mode
HS
XT
and temperature range for the application.
C1
C2
455 kHz
2.0 MHz
2: A series resistor (R
3: R
(1)
(1)
Typical Capacitor Values Used:
C1 and C2.
strip cut crystals.
F
16.0 MHz
XTAL
R
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
varies with the oscillator mode chosen.
S
Freq
(2)
Resonators Used:
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
OSC2
OSC1
16.0 MHz
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, LP, HS OR HSPLL
CONFIGURATION)
S
OSC1
) may be required for AT
56 pF
47 pF
33 pF
27 pF
22 pF
R
F
(3)
4.0 MHz
8.0 MHz
DS39616B-page 21
Sleep
PIC18FXXXX
OSC2
56 pF
47 pF
33 pF
27 pF
22 pF
To
Internal
Logic