PIC18F2431-I/SO Microchip Technology, PIC18F2431-I/SO Datasheet - Page 42

• Manufacturer Part Number: PIC18F2431-I/SO
• Description: IC PIC MCU FLASH 8KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2431-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4431 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2331/2431/4331/4431
3.4.4
An exit from a power-managed run mode to its corre-
sponding idle mode is executed by setting the IDLEN
bit and executing a SLEEP instruction. The CPU is
halted at the beginning of the instruction following the
SLEEP instruction. There are no changes to any of the
clock source status bits (OSTS, IOFS, or T1RUN).
While the CPU is halted, the peripherals continue to be
clocked from the previously selected clock source.
3.4.5
An exit from a power-managed run mode to Sleep
mode is executed by clearing the IDLEN and
SCS1:SCS0 bits and executing a SLEEP instruction.
The code is no different than the method used to invoke
Sleep mode from the normal operating (full power)
mode.
The primary clock and internal oscillator block are dis-
abled. The INTRC will continue to operate if the WDT
is enabled. The Timer1 oscillator will continue to run, if
enabled, in the T1CON register. All clock source status
bits are cleared (OSTS, IOFS and T1RUN).
DS39616B-page 40
EXIT TO IDLE MODE
EXIT TO SLEEP MODE
Preliminary
3.5
An exit from any of the power-managed modes is trig-
gered by an interrupt, a Reset or a WDT time-out. This
section discusses the triggers that cause exits from
power-managed modes. The clocking subsystem
actions are discussed in each of the power-managed
modes (see Sections 3.2 through 3.4).
Device behavior during Low-power mode exits is
summarized in Table 3-3.
3.5.1
Any of the available interrupt sources can cause the
device to exit a power-managed mode and resume full
power operation. To enable this functionality, an inter-
rupt source must be enabled by setting its enable bit in
one of the INTCON or PIE registers. The exit sequence
is initiated when the corresponding interrupt flag bit is
set. On all exits from Low-power mode by interrupt,
code execution branches to the interrupt vector if the
GIE/GIEH bit (INTCON<7>) is set. Otherwise, code
execution continues or resumes without branching
(see Section 9.0 “Interrupts”).
Note:
Wake From Power-Managed
Modes
If application code is timing sensitive, it
should wait for the OSTS bit to become set
before continuing. Use the interval during
the Low-power exit sequence (before
OSTS is set) to perform timing insensitive
“housekeeping” tasks.
EXIT BY INTERRUPT
 2003 Microchip Technology Inc.