PIC18F4580-I/P Microchip Technology, PIC18F4580-I/P Datasheet - Page 6

• Manufacturer Part Number: PIC18F4580-I/P
• Description: IC PIC MCU FLASH 16KX16 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4580-I/P

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 40-DIP (0.600", 15.24mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 36
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: SPI/I2C/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 13-ch x 10-bit
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2480/2580/4480/4580
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 129
11.0 Timer0 Module ......................................................................................................................................................................... 147
12.0 Timer1 Module ......................................................................................................................................................................... 151
13.0 Timer2 Module ......................................................................................................................................................................... 157
14.0 Timer3 Module ......................................................................................................................................................................... 159
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 163
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 173
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 187
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 227
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 247
20.0 Comparator Module.................................................................................................................................................................. 257
21.0 Comparator Voltage Reference Module ................................................................................................................................... 263
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 267
23.0 ECAN Module........................................................................................................................................................................... 273
24.0 Special Features of the CPU .................................................................................................................................................... 343
25.0 Instruction Set Summary .......................................................................................................................................................... 361
26.0 Development Support............................................................................................................................................................... 411
27.0 Electrical Characteristics .......................................................................................................................................................... 415
28.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 451
29.0 Packaging Information.............................................................................................................................................................. 453
Appendix A: Revision History............................................................................................................................................................. 461
Appendix B: Device Differences......................................................................................................................................................... 461
Appendix C: Conversion Considerations ........................................................................................................................................... 462
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 462
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 463
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 463
Index .................................................................................................................................................................................................. 465
The Microchip Web Site ..................................................................................................................................................................... 477
Customer Change Notification Service .............................................................................................................................................. 477
Customer Support .............................................................................................................................................................................. 477
Reader Response .............................................................................................................................................................................. 478
PIC18F2480/2580/4480/4580 Product Identification System ............................................................................................................ 479
DS39637C-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 61
Flash Program Memory .............................................................................................................................................................. 95
Data EEPROM Memory ........................................................................................................................................................... 105
8 x 8 Hardware Multiplier.......................................................................................................................................................... 111
Interrupts .................................................................................................................................................................................. 113
Preliminary
© 2007 Microchip Technology Inc.