ATSAM3U2EA-AU Atmel, ATSAM3U2EA-AU Datasheet - Page 373
![IC MCU 32BIT 128KB FLASH 144LQFP](/photos/6/72/67244/144l1-lqfp_sml.jpg)
ATSAM3U2EA-AU
Manufacturer Part Number
ATSAM3U2EA-AU
Description
IC MCU 32BIT 128KB FLASH 144LQFP
Manufacturer
Atmel
Series
SAM3Ur
Specifications of ATSAM3U2EA-AU
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
96MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
36K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b, 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Controller Family/series
SAM3U
No. Of I/o's
96
Ram Memory Size
36KB
Cpu Speed
96MHz
No. Of Timers
3
Rohs Compliant
Yes
Processor Series
ATSAM3x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
36 KB
Interface Type
4xUSART, 2xTWI, 5xSPI, Bus
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
96
Number Of Timers
8
Operating Supply Voltage
1.62 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3U-EK
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Figure 25-19. TDF Optimization: No TDF wait states are inserted if the TDF period is over when the next access begins
25.13.3
6430D–ATARM–25-Mar-11
6430D–ATARM–25-Mar-11
D[15:0]
A [23:2]
NCS0
NWE
MCK
NRD
TDF Optimization Disabled (TDF_MODE = 0)
read access on NCS0 (NRD controlled)
When optimization is disabled, tdf wait states are inserted at the end of the read transfer, so that
the data float period ends when the second access begins. If the hold period of the read1 con-
trolling signal overlaps the data float period, no additional tdf wait states will be inserted.
Figure
with no TDF optimization.
• read access followed by a read access on another chip select,
• read access followed by a write access on another chip select,
• read access followed by a write access on the same chip select,
25-20,
Figure 25-21
NRD_HOLD= 4
TDF_CYCLES = 6
and
Figure 25-22
Read to Write
Wait State
NWE_SETUP= 3
illustrate the cases:
write access on NCS0 (NWE controlled)
SAM3U Series
SAM3U Series
373
373
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