ATSAM3U4EA-CU Atmel, ATSAM3U4EA-CU Datasheet - Page 803

• Manufacturer Part Number: ATSAM3U4EA-CU
• Description: IC MCU 32BIT 256KB FLSH 144LFBGA
• Manufacturer: Atmel
• Series: SAM3Ur

Specifications of ATSAM3U4EA-CU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 52K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b, 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 52 KB
• Interface Type: 4xUSART, 2xTWI, 5xSPI, Bus
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 8
• Operating Supply Voltage: 1.62 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-CM3, AT91SAM3U-EK, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3U-EK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

37.3
Figure 37-2. Application Block Diagram
37.4
Table 37-1.
Notes:
6430D–ATARM–25-Mar-11
Pin Name
MCCDA
MCCK
MCDA0 - MCDA7
MCDB0 - MCDB7
MCDC0 - MCDC7
MCDD0 - MCDD7
Application Block Diagram
Pin Name List
1. I: Input, O: Output, PP: Push/Pull, OD: Open Drain.
2. When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK, MCCDA to HSMCIx_CDA,
(2)
MCCDB to HSMCIx_CDB, MCCDC to HSMCIx_CDC, MCCDD to HSMCIx_CDD, MCDAy to HSMCIx_DAy, MCDBy to
HSMCIx_DBy, MCDCy to HSMCIx_DCy, MCDDy to HSMCIx_DDy.
I/O Lines Description for 8-bit Configuration
Pin Description
Command/response
Clock
Data 0..7 of Slot A
Data 0..7 of Slot B
Data 0..7 of Slot C
Data 0..7 of Slot D
9 1011
1
2 3 4 5 6
ex: File System, Audio, Security, etc.
MMC
1213 8
Application Layer
7
HSMCI Interface
Physical Layer
9
1
2 3 4 5 6
Type
I/O/PP/OD
I/O
I/O/PP
I/O/PP
I/O/PP
I/O/PP
SDCard
(1)
7 8
Comments
CMD of an MMC or SDCard/SDIO
CLK of an MMC or SD Card/SDIO
DAT[0..7] of an MMC
DAT[0..3] of an SD Card/SDIO
DAT[0..7] of an MMC
DAT[0..3] of an SD Card/SDIO
DAT[0..7] of an MMC
DAT[0..3] of an SD Card/SDIO
DAT[0..7] of an MMC
DAT[0..3] of an SD Card/SDIO
SAM3U Series
803