LPC2939FBD208,551 NXP Semiconductors, LPC2939FBD208,551 Datasheet - Page 81

• Manufacturer Part Number: LPC2939FBD208,551
• Description: IC ARM9 MCU FLASH 768KB 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2939FBD208,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 152
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11027
• Package: 208LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Operating Supply Voltage: 1.8|3.3 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 160
• Interface Type: CAN/I2C/LIN/QSPI/UART/USB
• On-chip Adc: 24-chx10-bit
• Number Of Timers: 6
• For Use With: 568-4787 - BOARD EVAL LPC2939
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287113551

NXP Semiconductors
Table 43.
V
ground.
[1]
[2]
10. Application information
LPC2939_3
Product data sheet
Symbol
5.0 V ADC0
f
f
t
3.3 V ADC1/2
f
f
t
i(ADC)
s(max)
conv
i(ADC)
s(max)
conv
DD(CORE)
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Duty cycle clock should be as close as possible to 50 %.
[1]
= V
ADC dynamic characteristics
DD(OSC_PLL)
Parameter
ADC input frequency
maximum sampling rate
conversion time
ADC input frequency
maximum sampling rate
conversion time
10.1 Operating frequency selection
9.7 Dynamic characteristics: ADC
The LPC2939 is specified to operate at a maximum frequency of 125 MHz, maximum
temperature of 85 C, and maximum core voltage of 1.89 V.
that the user can achieve higher operating frequencies for the LPC2939 by controlling the
temperature and the core voltage accordingly.
; V
DD(IO)
= 2.7 V to 3.6 V; V
All information provided in this document is subject to legal disclaimers.
Conditions
f
f
n = resolution
in number of ADC
clock cycles
in number of bits
f
f
n = resolution
in number of ADC
clock cycles
in number of bits
i(ADC)
s
i(ADC)
s
= f
= f
resolution 2 bit
resolution 10 bit
resolution 2 bit
resolution 10 bit
i(ADC)
i(ADC)
= 4.5 MHz;
= 4.5 MHz;
Rev. 03 — 7 April 2010
DDA(ADC3V3)
/ (n + 1) with
/ (n + 1) with
amb
= 25 C (final testing). Both pre-testing and final testing use correlated
= 3.0 V to 3.6 V; all voltages are measured with respect to
ARM9 microcontroller with CAN, LIN, and USB
[2]
[2]
Min
4
-
-
3
2
4
-
-
3
2
Typ
-
-
-
-
-
-
-
-
-
-
Figure 30
and
Max
4.5
1500
400
11
10
4.5
1500
400
11
10
LPC2939
© NXP B.V. 2010. All rights reserved.
amb
Figure 31
= 85 C ambient
Unit
MHz
ksamples/s
ksamples/s
cycles
bits
MHz
ksamples/s
ksamples/s
cycles
bits
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