LPC2939FBD208,551 NXP Semiconductors, LPC2939FBD208,551 Datasheet - Page 99

• Manufacturer Part Number: LPC2939FBD208,551
• Description: IC ARM9 MCU FLASH 768KB 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2939FBD208,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 152
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11027
• Package: 208LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Operating Supply Voltage: 1.8|3.3 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 160
• Interface Type: CAN/I2C/LIN/QSPI/UART/USB
• On-chip Adc: 24-chx10-bit
• Number Of Timers: 6
• For Use With: 568-4787 - BOARD EVAL LPC2939
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287113551

NXP Semiconductors
6.16.4
6.16.4.1
6.16.4.2
6.16.5
6.16.5.1
6.17
6.17.1
6.17.2
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8.1
8.2
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9.1
9.2
9.3
9.4
9.5
9.6
9.7
10
10.1
10.2
10.3
10.4
10.5
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12
12.1
12.2
12.3
12.4
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16.1
16.2
16.3
16.4
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Package outline . . . . . . . . . . . . . . . . . . . . . . . . 89
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 63
Static characteristics. . . . . . . . . . . . . . . . . . . . 65
Dynamic characteristics . . . . . . . . . . . . . . . . . 74
Application information. . . . . . . . . . . . . . . . . . 81
Soldering of SMD packages . . . . . . . . . . . . . . 90
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 93
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 95
Legal information. . . . . . . . . . . . . . . . . . . . . . . 96
Contact information. . . . . . . . . . . . . . . . . . . . . 97
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Reset Generation Unit (RGU). . . . . . . . . . . . . 57
Functional description. . . . . . . . . . . . . . . . . . . 58
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 58
Power Management Unit (PMU). . . . . . . . . . . 59
Functional description. . . . . . . . . . . . . . . . . . . 59
Vectored interrupt controller . . . . . . . . . . . . . . 61
Functional description. . . . . . . . . . . . . . . . . . . 62
Clock description . . . . . . . . . . . . . . . . . . . . . . 62
Power consumption . . . . . . . . . . . . . . . . . . . . 70
Electrical pin characteristics . . . . . . . . . . . . . . 71
Dynamic characteristics: I/O and CLK_OUT pins,
internal clock, oscillators, PLL, and CAN . . . . 74
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 76
Dynamic characteristics: I
Dynamic characteristics: SPI . . . . . . . . . . . . . 77
Dynamic characteristics: flash memory and
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Dynamic characteristics: external static
memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Dynamic characteristics: ADC . . . . . . . . . . . . 81
Operating frequency selection . . . . . . . . . . . . 81
Suggested USB interface solutions . . . . . . . . 83
SPI signal forms . . . . . . . . . . . . . . . . . . . . . . . 87
XIN_OSC input . . . . . . . . . . . . . . . . . . . . . . . . 88
XIN_OSC Printed-Circuit Board (PCB) layout
guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Introduction to soldering . . . . . . . . . . . . . . . . . 90
Wave and reflow soldering . . . . . . . . . . . . . . . 90
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 90
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 91
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 96
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 97
2
C-bus interface. . . 77
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
ARM9 microcontroller with CAN, LIN, and USB
Document identifier: LPC2939_3
LPC2939
Date of release: 7 April 2010
All rights reserved.