MC9S08SL16CTL Freescale Semiconductor, MC9S08SL16CTL Datasheet - Page 353

• Manufacturer Part Number: MC9S08SL16CTL
• Description: MCU 16KB FLASH SLIC 28TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SL16CTL

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-TSSOP
• Processor Series: S08SL
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 6
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08EL32, DEMO9S08EL32AUTO
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Package: 28TSSOP
• Family Name: HCS08
• Maximum Speed: 40 MHz
• For Use With: DEMO9S08EL32 - BOARD DEMO FOR 9S08 EL MCUDEMO9S08EL32AUTO - DEMO BOARD EL32 AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering information for MC9S08EL32 Series and MC9S08SL16 Series devices.
B.1.1
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Freescale Semiconductor
Core
Family
- EL or SL
Status
- S = Auto Qualified
Main Memory Type
- 9 = Flash-based
1
2
Ordering Information
See Table 1-1 for a complete description of modules included on each device.
See
Device Number
Device Numbering Scheme
MC9S08EL32
MC9S08EL16
MC9S08SL16
MC9S08SL8
Table B-2
Figure B-1. MC9S08EL32 and MC9S08SL16 Device Numbering Scheme
Table B-1. Devices in the MC9S08EL32 Series and MC9S08SL16 Series
for package information.
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
S
1
9
FLASH
32,768
16,384
16,384
S08
8,192
Memory Size
- 32 Kbytes
- 16 Kbytes
EL n
Memory
RAM
1024
512
E1
C
EEPROM
Appendix B Ordering Information and Mechanical Drawings
512
256
xx
R
28-TSSOP, 20-TSSOP
Available Packages
Tape and Reel Suffix (optional)
- R = Tape and Reel
Temperature Option
- C = –40 to 85 °C
- V = –40 to 105 °C
- M = –40 to 125 °C
Package Designator
Two letter descriptor (refer to
Table
Mask Set Identifier — this
field only appears in “Auto
Qualified” part numbers
- Alpha character references
- Numeric character identifies
wafer fab.
mask.
B-2).
2
355