DF2210CUNP24V Renesas Electronics America, DF2210CUNP24V Datasheet - Page 520

• Manufacturer Part Number: DF2210CUNP24V
• Description: MCU 16BIT FLASH 3V 32K 64-QFN
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2210CUNP24V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

5. If a pin with pull-up function is SAMPLEed with pull-up function enabled, the corresponding
6. If a pin with open-drain function is SAMPLEed while its open-drain function is enabled and
7. If EXTEST, CLAMP, or HIGHZ state is entered, this LSI enters guarded mode such as
8. The EMLE pin must be cleared to 0. When the pin is set to 1, this chip functions as High-
Rev.7.00 Dec. 24, 2008 Page 464 of 698
REJ09B0074-0700
EMLE Pin
0
1
IN register is set to 1. In this case, the corresponding Control register must be cleared to 0.
while the corresponding OUT register is set to 1, the corresponding Control register is cleared
to 0 (the pin status is Hi-Z). If the pin is SAMPLEed while the corresponding OUT register is
cleared to 0, the corresponding Control register is set to 1 (the pin status is 0).
hardware standby mode (RES = STBY = 0). Before entering normal operating mode from
EXTEST, CLAMP, or HIGHZ state, specify RES, STBY, FWE, and MD2 to MD0 pin to the
designated mode.
performance user debugging interface (H-UDI).
Chip State
Normal operation, boundary scan function
High-performance user debugging interface (H-UDI)