D12350F20IV Renesas Electronics America, D12350F20IV Datasheet - Page 24
D12350F20IV
Manufacturer Part Number
D12350F20IV
Description
IC H8S/2350 MCU 4.5/5.5V 0+K I-T
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12350F20IV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Type
ROMless
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D12350F20IV
Manufacturer:
INF
Quantity:
4 834
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6.3
6.4
6.5
6.6
6.7
Rev. 3.00 Sep 15, 2006 page xxii of xxxiv
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.2.9
Overview of Bus Control .................................................................................................. 142
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
Basic Bus Interface ........................................................................................................... 148
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
DRAM Interface................................................................................................................ 161
6.5.1
6.5.2
6.5.3
6.5.4
6.5.5
6.5.6
6.5.7
6.5.8
6.5.9
6.5.10 Burst Operation.................................................................................................... 169
6.5.11 Refresh Control .................................................................................................... 172
DMAC Single Address Mode and DRAM Interface......................................................... 176
6.6.1
6.6.2
Burst ROM Interface......................................................................................................... 178
6.7.1
6.7.2
6.7.3
Bus Width Control Register (ABWCR)............................................................... 126
Access State Control Register (ASTCR).............................................................. 127
Wait Control Registers H and L (WCRH, WCRL) .............................................. 128
Bus Control Register H (BCRH).......................................................................... 132
Bus Control Register L (BCRL)........................................................................... 134
Memory Control Register (MCR) ........................................................................ 136
DRAM Control Register (DRAMCR).................................................................. 138
Refresh Timer/Counter (RTCNT)........................................................................ 141
Refresh Time Constant Register (RTCOR).......................................................... 141
Area Partitioning .................................................................................................. 142
Bus Specifications................................................................................................ 143
Memory Interfaces ............................................................................................... 144
Advanced Mode ................................................................................................... 145
Areas in Normal Mode......................................................................................... 146
Chip Select Signals .............................................................................................. 147
Overview.............................................................................................................. 148
Data Size and Data Alignment ............................................................................. 148
Valid Strobes....................................................................................................... 150
Basic Timing........................................................................................................ 151
Wait Control ........................................................................................................ 159
Overview.............................................................................................................. 161
Setting DRAM Space........................................................................................... 161
Address Multiplexing........................................................................................... 162
Data Bus............................................................................................................... 162
Pins Used for DRAM Interface............................................................................ 163
Basic Timing........................................................................................................ 164
Precharge State Control ....................................................................................... 165
Wait Control ........................................................................................................ 166
Byte Access Control............................................................................................. 168
When DDS = 1..................................................................................................... 176
When DDS = 0..................................................................................................... 177
Overview.............................................................................................................. 178
Basic Timing........................................................................................................ 178
Wait Control ........................................................................................................ 180
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