MC9S12XDT256MAA Freescale Semiconductor, MC9S12XDT256MAA Datasheet - Page 1252

• Manufacturer Part Number: MC9S12XDT256MAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 59
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
1
2
A.2.2
Three factors — source resistance, source capacitance and current injection — have an influence on the
accuracy of the ATD.
A.2.2.1
Due to the input pin leakage current as specified in
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
specifies results in an error of less than 1/2 LSB (2.5 mV) at the maximum leakage current. If device or
operating conditions are less than worst case or leakage-induced error is acceptable, larger values of source
resistance is allowed.
A.2.2.2
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage 1LSB, then the external filter capacitor, C
1254
Conditions are shown in
Num C
Full accuracy is not guaranteed when differential voltage is less than 3.15 V
The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
1
2
3
4
5
6
7
8
D Reference potential
C Differential reference voltage
D ATD clock frequency
D ATD 10-bit conversion period
D ATD 8-bit conversion period
D Recovery time (V
P Reference supply current 2 ATD blocks on
P Reference supply current 1 ATD block on
Factors Influencing Accuracy
Low
High
Clock cycles
Conv, time at 2.0 MHz ATD clock f
Clock cycles
Conv, time at 2.0 MHz ATD clock f
Source Resistance
Source Capacitance
Table A-4
2
2
DDA
= 5.0 Volts)
Table A-13. ATD Operating Characteristics 3.3V
unless otherwise noted, Supply Voltage 3.15V < VDDA < 3.6V
Rating
1
MC9S12XDP512 Data Sheet, Rev. 2.21
ATDCLK
ATDCLK
Table A-7
f
1024 * (C
N
V
T
Symbol
N
f
T
ATDCLK
RH
CONV10
CONV10
CONV8
CONV8
t
I
I
V
V
REC
REF
REF
RH
RL
-V
in conjunction with the source resistance
RL
INS
–C
V
V
3.15
DDA
Min
INN
0.5
14
12
SSA
—
—
—
7
6
/2
).
Typ
3.3
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
V
0.500
0.250
V
Max
DDA
3.6
2.0
28
14
26
13
20
DDA
/2
Cycles
Cycles
MHz
Unit
mA
mA
V
V
V
s
s
s
S