DF3048BVX25WV Renesas Electronics America, DF3048BVX25WV Datasheet - Page 55

• Manufacturer Part Number: DF3048BVX25WV
• Description: MCU 3/5V 128K PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3048BVX25WV

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

1.4.5
Care is required when changing from the H8/3048F-ONE with on-chip flash memory to a model
with on-chip H8/3048 Group mask ROM (H8/3048, H8/3047, H8/3045, or H8/3044).
An external capacitor must be connected to the V
V
a mask ROM version must therefore be taken into account when undertaking pattern design, etc.,
in the board design stage.
CL
pin occupies the same location as a V
0.1 F
(5 V operation model)
External
capacitor
Note on Changeover to H8/3048 Group Mask ROM Version
H8/3048F-ONE
Figure 1.6 Example of Board Pattern Providing for External Capacitor
Figure 1.5 Difference between 5 V and 3 V Operation Models
V
V
CC
CL
V
CL
pin
pin
5 V operation model
CC
pin in the on-chip mask ROM versions. Changeover to
V
CC
supply
power
CL
pin of the H8/3048F-ONE (5 V model). This
V
supply
CC
Land pattern for mask ROM version
(0
Land pattern for H8/3048F-ONE
(5 V operation model)
(0.1 F capacitor mounted)
Rev. 3.00 Sep 27, 2006 page 27 of 872
power
resistance mounted)
V
CC
3 V operation model
Section 1 Overview
REJ09B0325-0300