DF3048BVX25WV Renesas Electronics America, DF3048BVX25WV Datasheet - Page 899

MCU 3/5V 128K PB-FREE 100-TQFP

DF3048BVX25WV

Manufacturer Part Number
DF3048BVX25WV
Description
MCU 3/5V 128K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3048BVX25WV

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3048BVX25WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
priority.
P-QFP100-14x14-0.50
JEITA Package Code
100
76
e
PRQP0100KA-A
75
RENESAS Code
1
Appendix G Package Dimensions
Z
D
Figure G.1 Package Dimensions (FP-100B)
*1
H
D
D
y
FP-100B/FP-100BV
*3
b
Previous Code
p
51
25
50
26
x
F
M
MASS[Typ.]
1.2g
Rev. 3.00 Sep 27, 2006 page 871 of 872
Appendix G Package Dimensions
Terminal cross section
Detail F
b
b
1
p
L
1
L
REJ09B0325-0300
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
x
y
Z
Z
L
L
1
p
1
1
2
1
D
E
D
E
Dimension in Millimeters
15.7
15.7
0.00
0.17
0.12
Min
0.3
Nom
2.70
16.0
16.0
0.12
0.22
0.20
0.17
0.15
14
14
0.5
1.0
1.0
0.5
1.0
16.3
16.3
3.05
0.25
0.27
0.22
0.08
0.10
Max
0.7

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