DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 15

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

HEW Integrated Development Environment
New features to help optimize
your application code
The integrated simulator/debugger
has specific features and windows
for testing the application code
produced in the build process:
• Code profiling window (includes
• Performance analysis
• Code Coverage window
• Macro recorder and test case
Additional analysis tools help you
understand the operation and
architecture of your embedded
system application:
• Call Walker stack-trace analyzer
• Link Map file viewer
Project Manager
– Graphical control of
– Function browser
– Drag and drop code templates
– Built-in (or external)
Output Window
– Shows messages from
– Linked to source in editor
– Version-control log
Full Bus Trace
compiler/linker options
project make
build and find-in-files
statistical and graphical displays)
analysis
HEW Profile Tree and Chart views
H8
®
Development Tools
Virtual Desktop
– Allows multiple screen
layouts to be recalled at
the click of a button
Memory View
– Highlights changed
Complex Break
Conditions
values
Stack Trace
C/C++
Variable Watch
Local Variable
Watch