DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 42

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendices
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R4: Renesas H8S MCU
ROM type:
H8S device number
(with optional major revision letter)
Package (one- or two-letter code)
Maximum Speed (MHz)
Temperature range:
Package type:
R5: Renesas H8SX MCU
ROM type:
H8SX device number
(with optional major revision letter)
Temperature range (refer to R4 decoder, above)
Maximum Speed (MHz)
Package (one- or two-letter code)
Package type:
F = Flash
M = Mask ROM
S
F = Flash
M = Mask ROM
S
Appendix C-1: Catalog Part Number Decoders (1 of 2)
Blank = -20°C to +75°C (Standard temp.)
= ROMless or Standard Mask ROM
= ROMless or Standard Mask ROM
JE = -40°C to +105°C
K = -40°C to +125°C
V = Lead-free package
V = Lead-free package
J = -40°C to +85°C (Extended reliability)
I = -40°C to +85°C
R 4
R 5
X
X
# # # # X
6 # # # # X
X X
N
# #
# #
X X
X
V
V
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