DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 43

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendices
I
Renesas MCU
On-chip memory type:
Specific Series:
Product Version
Low Voltage
Package
Maximum Speed (MHz)
Temperature Range:
Optional Lead-Free Package:
Appendix C-2: Catalog Part Number Decoders (2 of 2)
1: ROMless
3: Masked ROM
7: OTP
8: EEPROM
F: Flash
N: EEPROM Multi-Chip Package
3XXX: H8
2XXX: H8S
(with optional major revision letter)
Blank: Default voltage operation
V:
(one- or two-letter code)
Blank: -20°C to +75°C
I:
J:
JE:
K:
V:
Low-voltage version
(Standard temp.)
-40°C to +85°C
-40°C to +85°C
(Extended reliability)
-40°C to +105°C
-40°C to +125°C
lead-free package
H D 6 4
X
# # # #
X
X
X X
#
X
V