DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 41

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

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Application Example 3: Intelligent Platform Management Interface (IPMI) Solution Using H8S/2166
Application Example 4: ePOS Solution Using H8SX/1653
Pulse Output
Keypad
Thermal
Control
Printer
Servers
(RS-485)
Chassis
EEPROM
Panel Control
Boards
ICMB
On-chip
Debug
x 6 ch
x 2 ch
10-bit
x 8 ch
INTC
DTC
DAC
8-bit
TPU
ADC
RS-485 Bridge
Sensor
EMP
PMC
Peripheral Bus
(multiplier/
H8SX CPU
Internal Bus
divider)
H8SX/1653F
Bridge
NIC
I/O Ports
x 8 ch
40KB
WDT
timer
PPG
RAM
DMA
8-bit
PLL
4 ch
USB 2.0
I
(Full Speed)
2
FLASH
x 6 ch
384KB
x 2 ch
C
ROM
BSC
SCI
I
Tachometer
2
C
Flash
EVC
(BMC)
2168
H8S/
Panel and
Controller
RAM
Fans
PWM
LCD
Speed
Magnetic
Card
Card
I/F
Application Examples
Host
Improved tamper resistance/cipher process speed
Realize low-cost solution
Supports many consortium standards
— Cipher process by Hardware (SIC)
— Global Platform/STIP, EMV,
— Provides 2-chip system solution
Card
VISAsmart, JEFF, FINREAD
Card
IC
I/F
SDR
PCI Boards
ADC
EEPROM
Main Processor
LPC
Chipset
SEL
EEPROM
TEMP
ROM
RAM
SCI
Secure IC
EEPROM
DIMM
Sensors
Detector
Timer
Crypt
CPU
Error