DF2166VTE33 Renesas Electronics America, DF2166VTE33 Datasheet - Page 152

MCU FLASH 3V 512K 33MHZ 144TQFP

DF2166VTE33

Manufacturer Part Number
DF2166VTE33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
6.3.4
WSCR2 is used to specify the wait mode and number of wait states in access to the 256-kbyte
extended area and CP extended area.
Bit
7
6
5
4
3
Rev. 3.00, 03/04, page 110 of 830
Bit Name
WMS10
WC11
WC10
WMS21
WMS20
Wait State Control Register 2 (WSCR2)
Initial
Value
0
1
1
0
0
R/W
R/W
R/W
R/W
R/W
R/W
Description
256-kbyte Extended Area Wait Mode Select 0
Selects the wait mode for access to the 256-kbyte extended
area when the CS256E bit in SYSCR and the AST256 bit in
WSCR are set to 1.
0: Program wait mode
1: Wait disabled mode
256-kbyte Extended Area Wait Count 1 and 0
Selects the number of program wait states to be inserted into
the data cycle for access to the 256-kbyte extended area
when the CS256E bit in SYSCR and the AST256 bit in WSCR
are set to 1.
00: Program wait state is not inserted
01: 1 program wait state is inserted
10: 2 program wait states are inserted
11: 3 program wait states are inserted
CP Extended Area Wait Mode Select 1 and 0
Selects the wait mode for access to the CP extended area
when the CPCSE and ASTCP bits in BCR2 are set to 1.
00: Program wait mode
01: Wait disabled mode
10: Pin wait mode
11: Pin auto-wait mode

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