DF2166VTE33 Renesas Electronics America, DF2166VTE33 Datasheet - Page 851

• Manufacturer Part Number: DF2166VTE33
• Description: MCU FLASH 3V 512K 33MHZ 144TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2166VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 25.13 JTAG Timing
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Note:
Item
ETCK clock cycle time
ETCK clock high pulse width
ETCK clock low pulse width
ETCK clock rise time
ETCK clock fall time
ETRST pulse width
Reset hold transition pulse width
ETMS setup time
ETMS hold time
ETDI setup time
ETDI hold time
ETDO data delay time
*
LAD3 to LAD0,
SERIRQ, CLKRUN
(Transmit signal)
LAD3 to LAD0,
SERIRQ, CLKRUN,
LFRAME
(Receive signal)
LAD3 to LAD0,
SERIRQ, CLKRUN
(Transmit signal)
When t
LCLK
LCLK
cyc
≤ t
TCKcyc
Figure 25.31 LPC Interface (LPC) Timing
Symbol Min.
t
t
t
t
t
t
t
t
t
t
t
t
TCKcyc
TCKH
TCKL
TCKr
TCKf
TRSTW
RSTHW
TMSS
TMSH
TDIS
TDIH
TDOD
t
t
TXD
OFF
40*
15
15


20
3
20
20
20
20

t
LCKH
t
RXS
t
LCKL
Max.
200*


5
5






20
t
Lcyc
t
RXH
Rev. 3.00, 03/04, page 809 of 830
Unit
ns
t
ns
cyc
Test Conditions
Figure 25.32
Figure 25.33
Figure 25.34