UPD70F3745GJ-GAE-AX Renesas Electronics America, UPD70F3745GJ-GAE-AX Datasheet - Page 814

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UPD70F3745GJ-GAE-AX

Manufacturer Part Number
UPD70F3745GJ-GAE-AX
Description
MCU 32BIT V850ES/JX3 144-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3745GJ-GAE-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
128
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
60K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3745GJ-GAE-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
UPD70F3745GJ-GAE-AX/JS
Manufacturer:
EPSON
Quantity:
188
Part Number:
UPD70F3745GJ-GAE-AX/JS
Manufacturer:
RENESAS
Quantity:
1 000
V850ES/JJ3
Write Cycle (CLKOUT Asynchronous): In Multiplexed Bus Mode
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
CS0 to CS3 (output)
A16 to A23 (output)
WR0, WR1 (output)
AD0 to AD15 (I/O)
CLKOUT (output)
ASTB (output)
WAIT (input)
Remark
RD is high level.
<17>
T1
<6>
<21>
<23>
<22>
<24>
Address
<11>
<25>
<7>
<27>
<26>
<28>
<18>
T2
CHAPTER
<16>
<19>
TW
29
Data
ELECTRICAL
<14>
T3
<20>
SPECIFICATIONS
Page 798 of 892

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