UPD70F3745GJ-GAE-AX Renesas Electronics America, UPD70F3745GJ-GAE-AX Datasheet - Page 818

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UPD70F3745GJ-GAE-AX

Manufacturer Part Number
UPD70F3745GJ-GAE-AX
Description
MCU 32BIT V850ES/JX3 144-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3745GJ-GAE-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
128
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
60K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3745GJ-GAE-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
UPD70F3745GJ-GAE-AX/JS
Manufacturer:
EPSON
Quantity:
188
Part Number:
UPD70F3745GJ-GAE-AX/JS
Manufacturer:
RENESAS
Quantity:
1 000
V850ES/JJ3
Read Cycle (CLKOUT Asynchronous): In Separate Bus Mode
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
CS0 to CS3
A0 to A23
AD0 to AD15
CLKOUT
Remark
WAIT
RD
(output)
(output)
(output)
(output)
(input)
(I/O)
WR0 and WR1 are high level.
Hi-Z
T1
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CHAPTER
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ELECTRICAL
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SPECIFICATIONS
Hi-Z
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