UPD70F3745GJ-GAE-AX Renesas Electronics America, UPD70F3745GJ-GAE-AX Datasheet - Page 904

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UPD70F3745GJ-GAE-AX

Manufacturer Part Number
UPD70F3745GJ-GAE-AX
Description
MCU 32BIT V850ES/JX3 144-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3745GJ-GAE-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
128
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
60K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3745GJ-GAE-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
UPD70F3745GJ-GAE-AX/JS
Manufacturer:
EPSON
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Part Number:
UPD70F3745GJ-GAE-AX/JS
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V850ES/JJ3
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
On-chip
debug
function
Electrical
specifica-
tions
Function
Cautions (DUC) In the on-chip debug mode, the DDO pin is forcibly set to the high-level output.
Cautions (other
than DUC)
Security ID
Absolute
maximum
ratings
Details of
Function
Do not mount a device that was used for debugging on a mass-produced product,
because the flash memory was rewritten during debugging and the number of
rewrites of the flash memory cannot be guaranteed.
Moreover, do not embed the debug monitor program into mass-produced
products.
Forced breaks cannot be executed if one of the following conditions is satisfied.
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication
• Standby mode is entered while standby release by a maskable interrupt is
The pseudo RRM function and DMM function do not operate if one of the
following conditions is satisfied.
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication
• Standby mode is entered while standby release by a maskable interrupt is
The standby mode is released by the pseudo RRM function and DMM function if
one of the following conditions is satisfied.
• Mode for communication between MINICUBE2 and the target device is CSIB0
• Mode for communication between MINICUBE2 and the target device is
Peripheral I/O registers that requires a specific sequence cannot be written with
the DMM function.
If a space where the debug monitor program is allocated is rewritten by flash self
programming, the debugger can no longer operate normally.
Be sure not to exceed the absolute maximum ratings (MAX. value) of each supply
voltage.
Do not directly connect the output (or I/O) pins of IC products to each other, or to
V
directly connected to each other.
Direct connection of the output pins between an IC product and an external circuit
is possible, if the output pins can be set to the high-impedance state and the
output timing of the external circuit is designed to avoid output conflict.
• Mode for communication between MINICUBE2 and the target device is
• Mode for communication between MINICUBE2 and the target device is
• Mode for communication between MINICUBE2 and the target device is
After the flash memory is erased, 1 is written to the entire area.
DD
between MINICUBE2 and the target device, are masked
prohibited
UARTA0, and the main clock has been stopped
between MINICUBE2 and the target device, are masked
prohibited
UARTA0, and the main clock has been stopped
UARTA0, and a clock different from the one specified in the debugger is used
for communication
or CSIB3
UARTA0, and the main clock has been supplied.
, V
CC
, and GND. Open-drain pins or open-collector pins, however, can be
Cautions
APPENDIX E LIST OF CAUTIONS
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