SAF-XC167CI-32F20F BB-A Infineon Technologies, SAF-XC167CI-32F20F BB-A Datasheet - Page 87

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SAF-XC167CI-32F20F BB-A

Manufacturer Part Number
SAF-XC167CI-32F20F BB-A
Description
IC MCU 16BIT 256KB TQFP-144-19
Manufacturer
Infineon Technologies
Series
XC16xr
Datasheet

Specifications of SAF-XC167CI-32F20F BB-A

Core Processor
C166SV2
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, UART/USART
Peripherals
PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.7 V
Data Converters
A/D 16x8/10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LFQFP
For Use With
B158-H8963-X-X-7600IN - KIT EASY XC167CIMCBX167-NET - BOARD EVAL INFINEON CAN/ETHRNTMCBXC167-BASIC - BOARD EVAL BASIC INFINEON XC16X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
FX167CI32F20FBBANT
FX167CI32F20FBBAXT
SAFXC167CI32F20FBBAT
SP000098776
SP000224700
5
5.1
Table 24
Parameter
Green Package PG-TQFP-144-7
Thermal resistance junction to case
Thermal resistance junction to leads
Standard Package P-TQFP-144-19
Thermal resistance junction to case
Thermal resistance junction to leads
Package Outlines
Figure 26
Data Sheet
0.22
144
1)
Index Marking
Package and Reliability
Packaging
Does not include plastic or metal protrusion of 0.25 max. per side
A
0.5
±0.05
Package Parameters
PG-TQFP-144-7 (Plastic Green Thin Quad Flat Package)
1
0.08
17.5
20
22
1)
M
D
A-B
D
C
144x
C
B
Symbol
R
R
R
R
0.2
0.2
ΘJC
ΘJL
ΘJC
ΘJL
0.08
A-B
A-B
85
D
D
4x
H 4x
Min.
H
Limit Values
0.6
±0.15
Max.
8
40
6
18
Package and Reliability
Unit
K/W
K/W
K/W
K/W
XC167CI-32F
Derivatives
V1.1, 2006-08
Notes
GPP05616

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