TWR-MCF51MM Freescale Semiconductor, TWR-MCF51MM Datasheet - Page 17

• Manufacturer Part Number: TWR-MCF51MM
• Description: TOWER SYSTEM BOARD MCF51MM
• Manufacturer: Freescale Semiconductor
• Series: ColdFire®, Flexis™r
• Type: MCUr

Specifications of TWR-MCF51MM

• Contents: Board, 3 Modules, MED-EKG Kit, Cables, Documentation, DVD
• Product: Microcontroller Modules
• Data Bus Width: 32 bit
• Core Processor: MCF51MM
• Clock Speed: 32 KHz
• Interface Type: RS232, RS485, CAN , USB
• Flash: 256 KB
• Operating Supply Voltage: 3.3 V
• Silicon Manufacturer: Freescale
• Core Architecture: Coldfire
• Core Sub-architecture: Coldfire V1
• Silicon Core Number: MCF51
• Silicon Family Name: Flexis - MCF51MM
• Rohs Compliant: Yes
• For Use With/related Products: Freescale Tower System, MCF51MM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P
V
loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
Freescale Semiconductor
I/O
DD
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
into account in power calculations, determine the difference between actual pin voltage and V
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
1
2
3
4
T

P
P
P
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s — Single layer board, one signal layer
2s2p — Four layer board, 2 signal and 2 power layers
JA
A
D
int
I/O
Thermal Characteristics
#
1
2
3
4
= Ambient temperature, C
= P
= Package thermal resistance, junction-to-ambient, C/W
= I
= Power dissipation on input and output pins — user determined
int
DD
P
 V
I/O
Symbol
DD
T
JMAX


T
, Watts — chip internal power
JA
JA
A
Operating temperature range (packaged):
Maximum junction temperature
Thermal resistance
Thermal resistance
Table 6. Thermal Characteristics
T
J
J
) in C can be obtained from:
= T
A
1,2,3,4
1, 2, 3, 4
+ (P
SS
Rating
MCF51MM256
MCF51MM128
104-pin MBGA
100-pin LQFP
81-pin MBGA
80-pin LQFP
104-pin MBGA
100-pin LQFP
81-pin MBGA
80-pin LQFP
or V
D
Single-layer board — 1s
Four-layer board — 2s2p
 
DD
JA
)
will be very small.
–40 to 105
–40 to 105
Value
135
67
53
67
53
39
41
39
39
Electrical Characteristics
C/W
C/W
Unit
C
C
SS
Eqn. 1
or
17