AT25DF081A-MH-T Atmel, AT25DF081A-MH-T Datasheet - Page 51

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AT25DF081A-MH-T

Manufacturer Part Number
AT25DF081A-MH-T
Description
IC FLASH 8MBIT SPI 8UDFN
Manufacturer
Atmel
Datasheet

Specifications of AT25DF081A-MH-T

Format - Memory
FLASH
Memory Type
DataFLASH
Memory Size
8M (4096 pages x 256 bytes)
Speed
100MHz
Interface
SPI, RapidS
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-UDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
8715B–SFLSH–8/10
17.3
8S2 – EIAJ SOIC
Notes: 1. This drawing is for general information only; refer to
packagedrawings@atmel.com
Package Drawing Contact:
2. Mismatch of the upper and lower dies and resin burrs
3. Determines the true geometric position.
4. Values b, C apply to plated terminal. The standard
EIAJ Drawing EDR-7320 for additional information.
are not included.
thickness of the plating layer shall measure between
0.007 to .021mm.
e e
Side View
Top View
D D
TITLE
8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ)
1 1
N N
A A
b b
A1
A1
E E
SYMBOL
A
A1
b
C
D
E1
E
L
q
e
q q
Atmel AT25DF081A
COMMON DIMENSIONS
(Unit of Measure = mm)
1.70
0.05
0.35
0.15
5.13
5.18
7.70
0.51
MIN
L L
GPC
E1
E1
1.27 BSC
STN
NOM
End View
DRAWING NO.
MAX
2.16
0.25
0.48
0.35
5.35
5.40
8.26
0.85
8S2
NOTE
4
4
2
3
4/15/08
REV.
F
51

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