3059Y-1-500LF Bourns Inc., 3059Y-1-500LF Datasheet - Page 13
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3059Y-1-500LF
Manufacturer Part Number
3059Y-1-500LF
Description
TRIMPOT 50 OHM 1.25"REC CER MT
Manufacturer
Bourns Inc.
Series
3059 - Sealedr
Specifications of 3059Y-1-500LF
Temperature Coefficient
±100ppm/°C
Resistance (ohms)
50
Termination Style
PC Pin
Power (watts)
1W
Tolerance
±10%
Number Of Turns
22
Adjustment Type
Side Adjustment
Resistive Material
Cermet
Mounting Type
Chassis Mount
Package / Case
Rectangular - 1.250" L x 0.190" W x 0.315" H (31.75mm x 4.83mm x 8.00mm)
Track Resistance
50ohm
No. Of Turns
22
Resistance Tolerance
± 10%
Power Rating
1W
Potentiometer Mounting
Through Hole
Resistance
50 Ohms
Operating Temperature Range
- 55 C to + 150 C
Element Type
Cermet
Dimensions
6.10 mm W x 31.75 mm L
Product
Trimmers
Taper
Linear
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Electrical Characteristics
Current Handling .......................................................................3 A, track width 1 mm
ESD (Contact)......................................................................................... ±8 kV, 10 times
ESD (Air)............................................................................................... ±15 kV, 10 times
Conductivity ...............................................................................1.6 µ ·cm, 1 oz copper
RF Capability ...............................................................................................up to 10 GHz
Environmental Characteristics
Temperature Cycling ...............................................................................-40 °C/+100 °C
Air Temperature Low.................................................................................-25 °C; 24 hrs
Air Temperature High...............................................................................+70 °C; 24 hrs
Humidity...................................................................................+85 °C; 85 % RH; 96 hrs
Thermal Shock .....................................................................-40 °C to +85 °C; 24 cycles
Physical Characteristics
Vibration Shock ..........................................................................................................30 G
Wear Resistance................................................................................20,000 cycles, 0.8 N
Peel Test .......................................................................................................................20 N
Pull Test .....................................................................................................................10 kN
Shear Test .......................................................................................40 N (0805; SOD123)
Solderability............................................................................................................
Lithium Salt Test..........................................................................................................Pass
Halt Test........................................................................................................................Pass
Wirebondable ................................................................................................................Yes
Weldable .........................................................................................................................Yes
Recyclable.......................................................................................................................Yes
Physical Characteristics
Min. Dimensions .................................................................................................
Wall Thickness ..................................................................................................
Track Width .........................................................................................................
Plating Composition........................................................................Cu, Ni, Sn/Pb & Au
Plating Thickness.............................................................................................2 to 50 µm
3-D Shapes .....................................................................................................................Yes
3-D MID Devices
Bourns is also applying our thick-film printing capabilities
to manufacture 3-D Molded Interconnect Devices (MIDs),
which integrate the housing with the circuit board. Two
advantages are board size and reduction of piece parts.
Applications include high frequency connectors, security
housings, antennas and EMC screening.
0.5 mm
70 µm
5 mm
95 %
Specifications are typical and dependent on
the manufacturing method, materials, size
and shape of the part.
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