3059Y-1-500LF Bourns Inc., 3059Y-1-500LF Datasheet - Page 157
![TRIMPOT 50 OHM 1.25"REC CER MT](/photos/8/49/84988/3059y_series_sml.jpg)
3059Y-1-500LF
Manufacturer Part Number
3059Y-1-500LF
Description
TRIMPOT 50 OHM 1.25"REC CER MT
Manufacturer
Bourns Inc.
Series
3059 - Sealedr
Specifications of 3059Y-1-500LF
Temperature Coefficient
±100ppm/°C
Resistance (ohms)
50
Termination Style
PC Pin
Power (watts)
1W
Tolerance
±10%
Number Of Turns
22
Adjustment Type
Side Adjustment
Resistive Material
Cermet
Mounting Type
Chassis Mount
Package / Case
Rectangular - 1.250" L x 0.190" W x 0.315" H (31.75mm x 4.83mm x 8.00mm)
Track Resistance
50ohm
No. Of Turns
22
Resistance Tolerance
± 10%
Power Rating
1W
Potentiometer Mounting
Through Hole
Resistance
50 Ohms
Operating Temperature Range
- 55 C to + 150 C
Element Type
Cermet
Dimensions
6.10 mm W x 31.75 mm L
Product
Trimmers
Taper
Linear
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
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Lead Free Solder Reflow Profile – SMD Trimmers
Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint’s
surface). Use the following criteria (ref. acceptability of printed board assemblies,
IPC-610A):
If unacceptable, determine cause and correct prior to next
run.
NOTES:
1. Water soluble solder paste only above 100K.
2. Refer to ref. temperature profile. Temperature at lead/pad junction with “K” type thermocouple.
3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified.
4. Ramp down rate to be measured from 255 °C to 150 °C.
5. Process Description 8 does not apply to open frame trimmers.
Process Description
1. Apply solder paste to test
2. Place test units onto board
3. Ramp up
4. Preheat
5. Time above liquidus
6. Peak temperature
7. Ramp down
8. Cleaning water clean profile
This is to ensure that all test units will see “worst case conditions”.
A) Acceptable (see Figure 1)
B) Unacceptable (see Figure 2)
board (8 - 10 mil thick)
(1) Feathered edges
(2) Concave fillet
(3) Fillet appears smooth
(1) Convex fillet
(2) Solder balls (5 balls or more per square inch)
5
Materials
• Sn Ag Cu Alloy water soluble
• Single sided epoxy glass
• PC board approx. 4x4x.06 in.
6 units/board
Convection oven
High pressure deionized water
65 PSI maximum
or no clean solder paste
(G10) (UL approved)
NO FEATHERED EDGES
1
FEATHERED EDGES
CONCAVE
Temperature
Room temperature
(see note 2)
150 °C to 190 °C
220 °C
Room temperature
72 °F to 160 °F
(22 °C to 71 °C)
CONVEX
Figure 1
Figure 2
2
(Derived using 6-zone Convection Oven)
Customers should verify actual device performance in
their specific applications.
Specifications are subject to change without notice.
Temperature of Lead/Pad Junction
300
255
220
190
150
0
0
Time Interval
2.5 °C ±0.5 °/second
90 +30 seconds
60-90 seconds
260 °C +0/–5 °C
10-20 sec. within 5 °C of peak
3 °C ±0.5 °C/second
As required
50
100
Time (Seconds)
150
200
250
REV 04/04
155
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