3059Y-1-500LF Bourns Inc., 3059Y-1-500LF Datasheet - Page 157

• Manufacturer Part Number: 3059Y-1-500LF
• Description: TRIMPOT 50 OHM 1.25"REC CER MT
• Manufacturer: Bourns Inc.
• Series: 3059 - Sealedr

Specifications of 3059Y-1-500LF

• Temperature Coefficient: ±100ppm/°C
• Resistance (ohms): 50
• Termination Style: PC Pin
• Power (watts): 1W
• Tolerance: ±10%
• Number Of Turns: 22
• Adjustment Type: Side Adjustment
• Resistive Material: Cermet
• Mounting Type: Chassis Mount
• Package / Case: Rectangular - 1.250" L x 0.190" W x 0.315" H (31.75mm x 4.83mm x 8.00mm)
• Track Resistance: 50ohm
• No. Of Turns: 22
• Resistance Tolerance: ± 10%
• Power Rating: 1W
• Potentiometer Mounting: Through Hole
• Resistance: 50 Ohms
• Operating Temperature Range: - 55 C to + 150 C
• Element Type: Cermet
• Dimensions: 6.10 mm W x 31.75 mm L
• Product: Trimmers
• Taper: Linear
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Lead Free Solder Reflow Profile – SMD Trimmers
Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint’s
surface). Use the following criteria (ref. acceptability of printed board assemblies,
IPC-610A):
If unacceptable, determine cause and correct prior to next
run.
NOTES:
1. Water soluble solder paste only above 100K.
2. Refer to ref. temperature profile. Temperature at lead/pad junction with “K” type thermocouple.
3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified.
4. Ramp down rate to be measured from 255 °C to 150 °C.
5. Process Description 8 does not apply to open frame trimmers.
Process Description
1. Apply solder paste to test
2. Place test units onto board
3. Ramp up
4. Preheat
5. Time above liquidus
6. Peak temperature
7. Ramp down
8. Cleaning water clean profile
This is to ensure that all test units will see “worst case conditions”.
A) Acceptable (see Figure 1)
B) Unacceptable (see Figure 2)
board (8 - 10 mil thick)
(1) Feathered edges
(2) Concave fillet
(3) Fillet appears smooth
(1) Convex fillet
(2) Solder balls (5 balls or more per square inch)
5
Materials
• Sn Ag Cu Alloy water soluble
• Single sided epoxy glass
• PC board approx. 4x4x.06 in.
6 units/board
Convection oven
High pressure deionized water
65 PSI maximum
or no clean solder paste
(G10) (UL approved)
NO FEATHERED EDGES
1
FEATHERED EDGES
CONCAVE
Temperature
Room temperature
(see note 2)
150 °C to 190 °C
220 °C
Room temperature
72 °F to 160 °F
(22 °C to 71 °C)
CONVEX
Figure 1
Figure 2
2
(Derived using 6-zone Convection Oven)
Customers should verify actual device performance in
their specific applications.
Specifications are subject to change without notice.
Temperature of Lead/Pad Junction
300
255
220
190
150
0
0
Time Interval
2.5 °C ±0.5 °/second
90 +30 seconds
60-90 seconds
260 °C +0/–5 °C
10-20 sec. within 5 °C of peak
3 °C ±0.5 °C/second
As required
50
100
Time (Seconds)
150
200
250
REV 04/04
155