AM29LV256MH113REI AMD (ADVANCED MICRO DEVICES), AM29LV256MH113REI Datasheet - Page 10

• Manufacturer Part Number: AM29LV256MH113REI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV256MH113REI

• Memory Size: 256Mbit
• Package/case: 56-TSOP
• Access Time, Tacc: 110nS
• Mounting Type: Surface Mount
• Supply Voltage: 3V

ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Valid Combinations list configurations planned to be supported in volume for
this device. Consult the local AMD sales office to confirm availability of specific
valid combinations and to check on newly released combinations.
Notes:
1. To select the product with ESN factory-locked into the SecSi Sector: 1) select the order number from the valid combinations
8
Am29LV256MH113R
Am29LV256ML113R
Am29LV256MH123R
Am29LV256ML123R
Am29LV256M
given above, 2)add designator “N” at the end of the order number, and 3) modify the speed option indicator as follows
[113R = 11R; 123R = 12R; 113, 123 = no change] Example: Am29LV256MH12RPGIN. For fortified BGA packages, the
designator “N” will also appear at the end of the package marking. Example: L256MH12RIN.
Valid Combinations for
TSOP Package
H
Valid Combinations
EI,
FI,
EF
DEVICE NUMBER/DESCRIPTION
Am29LV256MH/L
256 Megabit (16 M x 16-Bit/32 M x 8-Bit) MirrorBit Uniform Sector Flash Memory with VersatileIO
3.0 Volt-only Read, Program, and Erase
123R
Speed
(ns)
110
120
PG
1.65–3.6 V
1.65–3.6 V
Range
V
IO
I
TEMPERATURE RANGE
I
F
PACKAGE TYPE
E
F
PG
SPEED OPTION
See Product Selector Guide and Valid Combinations
SECTOR ARCHITECTURE AND SECTOR WRITE PROTECTION (WP# = V
H
L
D A T A S H E E T
3.0–3.6 V
Range
V
=
=
=
=
=
=
=
CC
Am29LV256M
Industrial (–40°C to +85°C)
Industrial (–40°C to +85°C) with Lead (Pb)-free package
56-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 056)
56-Pin Thin Small Outline Package (TSOP) Reverse Pinout (TSR056)
64-Ball Fortified Ball Grid Array,
1.0 mm pitch, 18 x 12 mm package (LAC064)
Uniform sector device, highest address sector protected
Uniform sector device, lowest address sector protected
Am29LV256MH113R
Am29LV256ML113R
Am29LV256MH123R
Am29LV256ML123R
Note:For 103, 103R, 110, and 120 speed option shown in product selector
guide, contact AMD for availability and ordering information.
Order Number
Valid Combinations for
Fortified BGA Package
PGF
PGI,
L256MH113R
L256ML113R
L256MH123R
L256ML123R
Package Marking
I,
F
December 16, 2005
Speed
(ns)
110
120
Range
1.65–
1.65–
3.6 V
3.6 V
TM
V
IO
Control
IL
Range
3.6 V
3.0–
)
V
CC