AM29LV256MH113REI AMD (ADVANCED MICRO DEVICES), AM29LV256MH113REI Datasheet - Page 63

• Manufacturer Part Number: AM29LV256MH113REI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV256MH113REI

• Memory Size: 256Mbit
• Package/case: 56-TSOP
• Access Time, Tacc: 110nS
• Mounting Type: Surface Mount
• Supply Voltage: 3V

ERASE AND PROGRAMMING PERFORMANCE
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V V
2. Maximum values are measured at VCC = 3.0, worst case temperature. Maximum values are valid up to and including 100,000
3. Word/Byte programming specification is based upon a single word/byte programming operation not utilizing the write buffer.
4. For 1-16 words or 1-32 bytes programmed in a single write buffer programming operation.
5. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation.
6. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure.
7. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See
8. The device has a minimum erase and program cycle endurance of 100,000 cycles.
TSOP PIN AND BGA PACKAGE CAPACITANCE
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
December 16, 2005
Parameter
Sector Erase Time
Chip Erase Time
Single Byte/Word
Program Time (Note 3)
Accelerated Single Byte/Word
Program Time
(Note 3)
Total Write Buffer Program
Time (Note 4)
Effective Write Buffer Program
Time (Note 5)
Total Accelerated Write Buffer
Program Time (Note 4)
Effective Accelerated Write
Buffer Program Time
(Note 5)
Chip Program Time
Parameter Symbol
all bits are programmed to 00h.
program/erase cycles.
11
for further information on command definitions.
C
C
C
OUT
IN2
IN
A
= 25°C, f = 1.0 MHz.
Control Pin Capacitance
Parameter Description
Output Capacitance
Per Word
Per Word
Input Capacitance
Per Byte
Per Byte
Word
Word
Byte
Byte
Typ (Note 1)
D A T A S H E E T
6.25
12.5
256
240
200
252
0.5
7.5
60
60
54
54
15
Am29LV256M
Max (Note 2)
V
V
V
OUT
IN
IN
1200
1040
= 0
= 0
512
600
540
540
584
3.5
600
38
75
33
65
= 0
Test Setup
CC
. Programming specifications assume that
Unit
TSOP
TSOP
TSOP
sec
sec
sec
BGA
BGA
BGA
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
Excludes 00h programming
prior to erasure (Note 6)
Excludes system level
Typ
4.2
8.5
5.4
7.5
3.9
6
overhead (Note 7)
Comments
Max
7.5
6.5
4.7
12
5
9
Unit
pF
pF
pF
pF
pF
pF
Table
61