AM29LV256MH113REI AMD (ADVANCED MICRO DEVICES), AM29LV256MH113REI Datasheet - Page 8

• Manufacturer Part Number: AM29LV256MH113REI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV256MH113REI

• Memory Size: 256Mbit
• Package/case: 56-TSOP
• Access Time, Tacc: 110nS
• Mounting Type: Surface Mount
• Supply Voltage: 3V

CONNECTION DIAGRAMS
SPECIAL PACKAGE HANDLING
INSTRUCTIONS
Special handling is required for Flash Memory products
in molded packages (TSOP and BGA). The package
6
RY/BY#
A13
WE#
NC
A5
A4
A3
A2
A1
NC
A8
A7
A6
A9
A7
A3
WP#/ACC
RESET#
A22
A12
A17
NC
A8
A4
B8
B7
B6
B5
B4
B3
B2
B1
2
A23
A21
A14
A10
A18
NC
A6
A2
C8
C7
C6
C5
C4
C3
C2
C1
Top View, Balls Facing Down
3
1
D A T A S H E E T
A15
A11
A19
A20
V
Fortified BGA
NC
Am29LV256M
D8
D7
D6
D5
D4
D3
A5
D2
A1
D1
IO
DQ7
DQ5
DQ2
DQ0
A16
V
NC
E8
E7
E6
E5
E4
E3
E2
A0
E1
and/or data integrity may be compromised if the
package body is exposed to temperatures above
150°C for prolonged periods of time.
SS
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
V
NC
F8
F7
F6
F5
F4
F3
F2
F1
IO
DQ15/A-1
DQ13
DQ11
DQ9
OE#
V
NC
G8
G7
G6
G5
G4
G3
G2
G1
NC
CC
DQ6
DQ4
DQ3
DQ1
V
V
H8
NC
H7
H6
H5
H4
H3
H2
H1
NC
SS
SS
December 16, 2005