AM29LV320DT90EI AMD (ADVANCED MICRO DEVICES), AM29LV320DT90EI Datasheet - Page 5

• Manufacturer Part Number: AM29LV320DT90EI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV320DT90EI

• Memory Configuration: 4M X 8 / 2M X 16 Bit
• Package/case: 48-TSOP
• Supply Voltage Max: 3.6V
• Leaded Process Compatible: No
• Peak Reflow Compatible (260 C): No
• Access Time, Tacc: 90nS
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

TABLE OF CONTENTS
Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1
General Description . . . . . . . . . . . . . . . . . . . . . . . 2
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10
Common Flash Memory Interface (CFI) . . . . . . . 21
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25
December 14, 2005
Continuity of Specifications ....................................................... i
For More Information ................................................................. i
Special Package Handling Instructions .................................... 7
Word/Byte Configuration ........................................................ 11
Requirements for Reading Array Data ................................... 11
Writing Commands/Command Sequences ............................ 11
Standby Mode ........................................................................ 12
Automatic Sleep Mode ........................................................... 12
RESET#: Hardware Reset Pin ............................................... 12
Output Disable Mode .............................................................. 12
Autoselect Mode ..................................................................... 16
Sector/Sector Block Protection and Unprotection .................. 17
Write Protect (WP#) ................................................................ 18
Temporary Sector Unprotect .................................................. 18
Secured Silicon Sector Flash Memory Region ....................... 20
Hardware Data Protection ...................................................... 21
Reading Array Data ................................................................ 25
ARCHITECTURAL ADVANTAGES ...................................... 1
PERFORMANCE CHARACTERISTICS ............................... 1
SOFTWARE FEATURES ..................................................... 1
HARDWARE FEATURES .................................................... 1
Table 1. Am29LV320D Device Bus Operations ..............................10
Accelerated Program Operation .......................................... 11
Autoselect Functions ........................................................... 11
Table 2. Top Boot Sector Addresses (Am29LV320DT) ..................13
Table 3. Top Boot Secured Silicon Sector Addresses ................... 14
Table 4. Bottom Boot Sector Addresses (Am29LV320DB) .............14
Table 5. Bottom Boot Secured Silicon Sector Addresses .............. 15
Table 6. Autoselect Codes (High Voltage Method) ........................16
Table 7. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection .............................................................17
Table 8. Bottom Boot Sector/Sector Block
Addresses for Protection/Unprotection ...........................................17
Figure 1. Temporary Sector Unprotect Operation........................... 18
Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 19
Factory Locked: Secured Silicon Sector Programmed
and Protected at the Factory ............................................... 20
Customer Lockable: Secured Silicon Sector NOT Programmed
or Protected at the Factory .................................................. 20
Figure 3. Secured Silicon Sector Protect Verify .............................. 21
Low VCC Write Inhibit ......................................................... 21
Write Pulse “Glitch” Protection ............................................ 21
Logical Inhibit ...................................................................... 21
Power-Up Write Inhibit ......................................................... 21
Table 9. CFI Query Identification String .......................................... 22
Table 10. System Interface String................................................... 22
Table 11. Device Geometry Definition ............................................ 23
Table 12. Primary Vendor-Specific Extended Query ...................... 24
D A T A S H E E T
Am29LV320D
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Word/Byte Configuration (BYTE#) ............................................. 40
Erase and Program Operations ................................................. 41
Temporary Sector Unprotect ..................................................... 46
Alternate CE# Controlled Erase and Program Operations ........ 48
Reset Command ..................................................................... 25
Autoselect Command Sequence ............................................ 25
Enter Secured Silicon Sector/Exit Secured Silicon Sector
Command Sequence .............................................................. 25
Byte/Word Program Command Sequence ............................. 26
Chip Erase Command Sequence ........................................... 27
Sector Erase Command Sequence ........................................ 27
Erase Suspend/Erase Resume Commands ........................... 28
Command Definitions ............................................................. 29
DQ7: Data# Polling ................................................................. 30
RY/BY#: Ready/Busy# ............................................................ 31
DQ6: Toggle Bit I .................................................................... 31
DQ2: Toggle Bit II ................................................................... 31
Reading Toggle Bits DQ6/DQ2 ............................................... 32
DQ5: Exceeded Timing Limits ................................................ 32
DQ3: Sector Erase Timer ....................................................... 32
CMOS Compatible .................................................................. 35
Zero-Power Flash ................................................................. 36
Read-Only Operations ........................................................... 38
Hardware Reset (RESET#) .................................................... 39
Table 13. Autoselect Codes ........................................................... 25
Unlock Bypass Command Sequence .................................. 26
Figure 4. Program Operation ......................................................... 27
Figure 5. Erase Operation.............................................................. 28
Table 14. Am29LV320D Command Definitions ............................. 29
Figure 6. Data# Polling Algorithm .................................................. 30
Figure 7. Toggle Bit Algorithm........................................................ 31
Table 15. Write Operation Status ................................................... 33
Figure 8. Maximum Negative Overshoot Waveform ...................... 34
Figure 9. Maximum Positive Overshoot Waveform........................ 34
Figure 10. I
Automatic Sleep Currents) ............................................................. 36
Figure 11. Typical I
Figure 12. Test Setup.................................................................... 37
Table 16. Test Specifications ......................................................... 37
Figure 13. Input Waveforms and Measurement Levels ................. 37
Figure 14. Read Operation Timings ............................................... 38
Figure 15. Reset Timings ............................................................... 39
Figure 16. BYTE# Timings for Read Operations............................ 40
Figure 17. BYTE# Timings for Write Operations............................ 40
Figure 18. Program Operation Timings.......................................... 42
Figure 19. Chip/Sector Erase Operation Timings .......................... 43
Figure 20. Data# Polling Timings (During Embedded Algorithms). 44
Figure 21. Toggle Bit Timings (During Embedded Algorithms)...... 45
Figure 22. DQ2 vs. DQ6................................................................. 45
Figure 23. Temporary Sector Unprotect Timing Diagram .............. 46
Figure 24. Accelerated Program Timing Diagram.......................... 46
Figure 25. Sector/Sector Block Protect and
Unprotect Timing Diagram ............................................................. 47
Figure 26. Alternate CE# Controlled Write
CC1
Current vs. Time (Showing Active and
CC1
vs. Frequency ............................................ 36
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