BUP314D Infineon Technologies, BUP314D Datasheet

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BUP314D

Manufacturer Part Number
BUP314D
Description
IGBT 1200V 42A W/DIODE DUO-PK
Manufacturer
Infineon Technologies
Datasheets

Specifications of BUP314D

Package / Case
TO-218AB/5
Voltage - Collector Emitter Breakdown (max)
1200V
Vce(on) (max) @ Vge, Ic
3.2V @ 15V, 25A
Current - Collector (ic) (max)
42A
Power - Max
300W
Input Type
Standard
Mounting Type
Through Hole
Configuration
Single
Collector- Emitter Voltage Vceo Max
1200 V
Maximum Gate Emitter Voltage
+/- 20 V
Maximum Operating Temperature
+ 150 C
Continuous Collector Current Ic Max
42 A
Minimum Operating Temperature
- 55 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Igbt Type
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Request inventory verification / Request inventory verification
Other names
BUP314DIN

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BUP314D
Manufacturer:
SIEMENS
Quantity:
5 510
Part Number:
BUP314D
Manufacturer:
FSC
Quantity:
20 000
Low Loss DuoPack : IGBT in TrenchStop
Type
IKW25T120
Maximum Ratings
Parameter
Collector-emitter voltage
DC collector current
T
T
Pulsed collector current, t
Turn off safe operating area
V
Diode forward current
T
T
Diode pulsed current, t
Gate-emitter voltage
Short circuit withstand time
V
Power dissipation
T
Operating junction temperature
Storage temperature
1
2)
Power Semiconductors
C
C
CE
C
C
GE
C
J-STD-020 and JESD-022
Allowed number of short circuits: <1000; time between short circuits: >1s.
= 25 C
= 100 C
= 25 C
= 100 C
= 25 C
Approx. 1.0V reduced V
Short circuit withstand time – 10 s
Designed for :
TrenchStop
offers :
NPT technology offers easy parallel switching capability due to
positive temperature coefficient in V
Low EMI
Low Gate Charge
Very soft, fast recovery anti-parallel EmCon HE diode
Qualified according to JEDEC
Pb-free lead plating; RoHS compliant
Complete product spectrum and PSpice Models :
= 15V, V
1200V, T
and 0.5V reduced V
- Frequency Converters
- Uninterrupted Power Supply
- very tight parameter distribution
- high ruggedness, temperature stable behavior
CC
j
®
1200V
1200V, T
150 C
and Fieldstop technology for 1200 V applications
V
CE
p
limited by T
p
j
25A
limited by T
2)
CE(sat)
F
I
C
with soft, fast recovery anti-parallel EmCon HE diode
compared to BUP314D
150 C
V
1
CE(sat),Tj=25°C
for target applications
jmax
1.7V
jmax
CE(sat)
TrenchStop
150 C
T
j,max
1
http://www.infineon.com/igbt/
®
Marking Code
and Fieldstop technology
®
K25T120
Series
Symbol
V
I
I
-
I
I
V
t
P
T
T
C
C p u l s
F
F p u l s
S C
j
s t g
C E
G E
t o t
PG-TO-247-3
Package
-40...+150
-55...+150
IKW25T120
Value
1200
190
50
25
75
75
50
25
75
10
20
Rev. 2.2 Sep 08
PG-TO-247-3
G
V
Unit
A
V
W
C
s
C
E

Related parts for BUP314D

BUP314D Summary of contents

Page 1

... Low Loss DuoPack : IGBT in TrenchStop with soft, fast recovery anti-parallel EmCon HE diode Approx. 1.0V reduced V CE(sat) and 0.5V reduced V compared to BUP314D F Short circuit withstand time – Designed for : - Frequency Converters - Uninterrupted Power Supply ® TrenchStop and Fieldstop technology for 1200 V applications ...

Page 2

Soldering temperature, 1.6mm (0.063 in.) from case for 10s Power Semiconductors ® TrenchStop Series - 2 IKW25T120 260 Rev. 2.2 Sep 08 ...

Page 3

Thermal Resistance Parameter Characteristic IGBT thermal resistance, junction – case Diode thermal resistance, junction – case Thermal resistance, junction – ambient Electrical Characteristic unless otherwise specified j Parameter Static Characteristic Collector-emitter breakdown voltage Collector-emitter saturation ...

Page 4

Dynamic Characteristic Input capacitance Output capacitance Reverse transfer capacitance Gate charge Internal emitter inductance measured 5mm (0.197 in.) from case 1) Short circuit collector current Switching Characteristic, Inductive Load Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off ...

Page 5

Switching Characteristic, Inductive Load Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Total switching energy Anti-Parallel Diode Characteristic Diode reverse recovery time Diode reverse recovery charge Diode peak reverse ...

Page 6

T =80°C C 50A 40A T =110°C C 30A I c 20A I 10A c 0A 10Hz 100Hz 1kHz f, SWITCHING FREQUENCY Figure 1. Collector current as a function of switching frequency (T 150 0.5, ...

Page 7

V =17V GE 15V 50A 13V 40A 11V 9V 30A 7V 20A 10A COLLECTOR EMITTER VOLTAGE CE Figure 5. Typical output characteristic (T = 25°C) j 70A 60A 50A ...

Page 8

I , COLLECTOR CURRENT C Figure 9. Typical switching times as a function of collector current (inductive load, T =150° =600V, V =0/15V, R ...

Page 9

E and E include losses on ts due to diode recovery 14,0mJ 12,0mJ 10,0mJ 8,0mJ 6,0mJ 4,0mJ E off 2,0mJ 0,0mJ 10A 20A 30A I , COLLECTOR CURRENT C Figure 13. Typical switching ...

Page 10

Q , GATE CHARGE GE Figure 17. Typical gate charge (I = 15µs 10µs 5µs 0µs 12V 14V GATE EMITTETR VOLTAGE GE Figure 19. Short circuit ...

Page 11

V CE 600V 400V 200V 1us 0.5us 0us t, TIME Figure 21. Typical turn on behavior (V =0/15V, R =22Ω Dynamic test circuit in Figure E) D=0.5 0 K/W 0.1 0.05 0.02 ...

Page 12

DIODE CURRENT SLOPE F Figure 23. Typical reverse recovery time as a function of diode current slope (V =600V, I =25A Dynamic test circuit in Figure E) ...

Page 13

T =25°C J 60A 150°C 40A 20A FORWARD VOLTAGE F Figure 27. Typical diode forward current as a function of forward voltage Power Semiconductors ® TrenchStop Series 2,0V I =50A F 25A 1,5V 15A 8A ...

Page 14

MIN 4.90 2.27 1.85 1.07 1.90 1.90 2.87 2.87 0.55 20.82 16.25 1.05 15.70 13.10 3.68 1.68 19.80 4.17 3.50 5.49 6.04 Power Semiconductors ® TrenchStop Series PG-TO247 MAX MIN MAX 5.16 0.193 0.203 2.53 0.089 0.099 2.11 ...

Page 15

Figure A. Definition of switching times Figure B. Definition of switching losses Power Semiconductors ® TrenchStop Series i Figure C. Definition of diodes switching characteristics (t) j p(t) r Figure ...

Page 16

... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life ...

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