DSP56301VF100 Freescale, DSP56301VF100 Datasheet - Page 79

• Manufacturer Part Number: DSP56301VF100
• Manufacturer: Freescale

Specifications of DSP56301VF100

• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 100MHz
• Mips: 100
• Device Input Clock Speed: 100MHz
• Ram Size: 24KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 252
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Not Compliant

Packaging
This section provides information on the available packages for the DSP56301, including diagrams of the package
pinouts and tables showing how the signals discussed in Section 1 are allocated for each package. The DSP56301
is available in two package types:
Note: Both packages are available in lead-bearing and lead-free versions. Switching a design from a lead-bearing
Freescale Semiconductor
•
•
208-pin Thin Quad Flat Pack (TQFP)
252-pin Molded Array Process-Ball Grid Array (MAP-BGA)
package device to a lead-free package device may require a change in the board manufacturing process.
The lead-free package requires a higher solder flow temperature than the lead-bearing device. Refer to
Lead-Free BGA Solder Joint Assembly Evaluation (EB635) for manufacturing considerations when
incorporating lead-free package devices into a design.
DSP56301 Technical Data, Rev. 10
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