DSP56301VF100 Freescale, DSP56301VF100 Datasheet - Page 79
DSP56301VF100
Manufacturer Part Number
DSP56301VF100
Description
Manufacturer
Freescale
Datasheet
1.DSP56301VF100.pdf
(124 pages)
Specifications of DSP56301VF100
Device Core Size
24b
Format
Fixed Point
Clock Freq (max)
100MHz
Mips
100
Device Input Clock Speed
100MHz
Ram Size
24KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
252
Package Type
MA-BGA
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSP56301VF100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
DSP56301VF100
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
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Packaging
This section provides information on the available packages for the DSP56301, including diagrams of the package
pinouts and tables showing how the signals discussed in Section 1 are allocated for each package. The DSP56301
is available in two package types:
Note: Both packages are available in lead-bearing and lead-free versions. Switching a design from a lead-bearing
Freescale Semiconductor
•
•
208-pin Thin Quad Flat Pack (TQFP)
252-pin Molded Array Process-Ball Grid Array (MAP-BGA)
package device to a lead-free package device may require a change in the board manufacturing process.
The lead-free package requires a higher solder flow temperature than the lead-bearing device. Refer to
Lead-Free BGA Solder Joint Assembly Evaluation (EB635) for manufacturing considerations when
incorporating lead-free package devices into a design.
DSP56301 Technical Data, Rev. 10
3
3-1
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