ALXD800EEXJ2VC C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VC C3 Datasheet - Page 606

• Manufacturer Part Number: ALXD800EEXJ2VC C3
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJ2VC C3

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Note 1. Refer to the Table 3-5 "Ball Assignments - Sorted by Ball Number" on page 26 for package signal names associated
Note 2. The SDA pad is designed to use a pull-up on-chip functionally, hence I
606
Symbol
I
C
OL
IO
with each buffer type.
Parameter
Output Low Current, Note 1
PCI
24/Q3
24/Q5
24/Q7
5V
DDR (BA[1:0], MA[13:0])
DDR (DQ[63:0], CKE[1:0],
CS[3:0]#, RAS[1:0]#, CAS[1:0]#,
WE[1:0]#, DQS[7:0], DQM[7:0],
TLA[1:0]
DDRCLK
Input and Output Capacitance, Note 1
PCI
24/Q3
24/Q5
24/Q7
5V
DDR
DDRCLK
33234H
Table 7-7. DC Characteristics (Continued)
1500
24.0
24.0
24.0
16.0
15.2
10.0
Min
11
Max
15.0
8.0
5.0
5.0
5.0
5.0
8.0
OH
is not used to drive high, I
AMD Geode™ LX Processors Data Book
Units
mA
mA
mA
mA
mA
mA
mA
µA
pF
pF
pF
pF
pF
pF
pF
Comments
I
V
drive set for pad
I
drive set for pad
OL
OL
O
= V
min = 11 mA with half-
min = 8 mA with quarter-
Electrical Specifications
OL
(Max)
LEAK
is instead