KC80526LY400128 Intel, KC80526LY400128 Datasheet - Page 40

• Manufacturer Part Number: KC80526LY400128
• Manufacturer: Intel

Specifications of KC80526LY400128

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

5.3.2
The Celeron processor mobile module MMC-1 weighs
approximately 50 grams.
6.0
6.1
The typical TDP is the typical total power dissipation under
normal operating conditions at nominal V_CORE (CPU
power supply) while executing the worst case power
instruction mix. The power handling capability of the system
thermal solution may be reduced less than the
recommended typical thermal design power with the
2.413 mm
1.
2.
NOTE:
TDP
Symbol
module
+ 0.050 mm
- 0.025 mm
hole diameter
During all operating environments, the processor temperature, T
TDP
Module Weight
THERMAL SPECIFICATION
Thermal Design Power
module
Figure 16. Standoff Holes, Board Edge Clearance, and EMI Containment Ring (Topside)
Thermal Design Power
is a thermal solution design reference point for OEM thermal solution readiness for total module power.
Parameter
Table 24. Thermal Design Power Specifications
Hole detail, 3 places
Typical
11.5 W
J
must be within the specified range of 0 Celsius to 100 Celsius.
implementation of firmware/software control or “throttling”
that reduces CPU power consumption and dissipation. This
includes the power dissipated by all of the relevant
components. During all operating environments, the
processor junction temperature, T
of 0 Celsius to 100 Celsius.
6.2
The thermal sensor implements the SMBALERT# signal
described in the SMBus specification. SMBALERT# is
always asserted when the temperature of the processor core
thermal diode or the thermal sensor internal temperature
exceeds either the upper or lower temperature thresholds.
SMBALERT# may also be asserted if the measured
temperature equals either the upper or the lower threshold.
Intel Celeron
Module = core, 82443DX, and voltage regulator.
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
3.81+/-0.19 mm
0.762 mm width of EMI containment ring
2.54+/-0.19 mm keep-out area
1.27+/- 0.19 mm board edge to EMI ring
3.81+/-0.19 mm board edge to hole centerline
Thermal Sensor Setpoint
Processor Mobile Module MMC-1
Notes
4.45 mm diameter grounded ring
J
, must be within the range
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