SSTU32866EC-S NXP Semiconductors, SSTU32866EC-S Datasheet - Page 26
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SSTU32866EC-S
Manufacturer Part Number
SSTU32866EC-S
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SSTU32866EC-S.pdf
(29 pages)
Specifications of SSTU32866EC-S
Logic Family
SSTU
Logical Function
Registered Buffer
Number Of Elements
1
Number Of Bits
25
Number Of Inputs
25
Number Of Outputs
25
High Level Output Current
-8mA
Low Level Output Current
8mA
Package Type
LFBGA
Propagation Delay Time
3ns
Operating Supply Voltage (typ)
1.8V
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Clock-edge Trigger Type
Posit/Negat-Edge
Polarity
Non-Inverting
Technology
CMOS
Frequency (max)
450(Min)MHz
Mounting
Surface Mount
Pin Count
96
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
Philips Semiconductors
14. Abbreviations
9397 750 14181
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 12:
Acronym
CMOS
DDR
DIMM
JEDEC
LFBGA
LVCMOS
PPO
PRR
RDIMM
SSTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Complementary Metal Oxide Silicon
Double Data Rate
Dual In-line Memory Module
Joint Electron Device Engineering Council
Low profile Fine-pitch Ball Grid Array
Low Voltage Complementary Metal Oxide Silicon
Partial Parity Out
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Rev. 02 — 11 November 2004
1.8 V DDR2 configurable registered buffer with parity
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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